Stacked Chip Power Assembly for Shorter Current Paths
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Solution Overview
Problem
Existing power supply modules in data centers face challenges in achieving high efficiency, high power density, and small volume due to long current paths caused by the separation of power supply modules from processor chips, leading to increased energy losses.
Innovation Solution
The proposed assembly structure includes a circuit board, a chip, and a first power converting module stacked together, with the power converting module electrically connected to both the circuit board and the chip, converting electrical energy and reducing current path length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power supply module is separated from the processor chip and placed on the main board, then the chip can be properly connected and fixed, but the current path becomes long causing increased energy losses
Solution Approach 1:
The patent transitions from a planar layout where the power supply module is placed on the main board to a three-dimensional stacked architecture. The power supply module is positioned vertically above the processor chip through stacking, changing the spatial dimension from 2D to 3D. This vertical arrangement dramatically shortens the current path while maintaining reliable electrical connections through vertically arranged contact structures.
Solution Approach 2:
The patent implements a nested structure where the power supply module is stacked directly above the processor chip, with the power supply module containing internal sub-components arranged in nested configurations. The contact structures are nested within the stacked assembly, with upper and lower contact structures interlocking to establish electrical connections while minimizing spatial occupation and current path length.
2Loss of energy
If the power supply module is placed close to the processor chip, then the current path is shortened reducing energy losses, but the area occupancy of components increases
Solution Approach 1:
The patent resolves the area occupancy issue by moving the power supply module from a horizontal placement on the main board to a vertical stacking configuration above the processor chip. This dimensional change from 2D planar arrangement to 3D vertical stacking significantly reduces the footprint area occupied by both components while maintaining close proximity for short current paths.
Solution Approach 2:
The patent merges the power supply module and processor chip into a single stacked assembly unit that functions as an integrated power-delivery system. By combining these components vertically rather than placing them separately on the main board, the overall area occupancy is reduced while the internal current paths remain short and efficient.
3Reliability
If additional members are used to fix the processor chip to the main board, then connection reliability is improved, but the space around the chip is occupied preventing the power supply module from being close
Solution Approach 1:
The patent eliminates the need for additional fixing members by transitioning to a vertical stacking architecture. The power supply module is positioned directly above the processor chip with vertical contact structures that provide both mechanical support and electrical connection, removing the requirement for lateral fixing members that would occupy space around the chip.
Solution Approach 2:
The patent merges the fixing function and electrical connection function into the stacked contact structures. The upper and lower contact structures serve dual purposes of mechanically securing the power supply module to the processor chip while simultaneously providing electrical pathways, eliminating the need for separate fixing members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces current transmission losses, lowers area occupancy of components, and saves space in the system, thereby enhancing the efficiency and power density of the power supply module.
Implementation Method 1
a first power converting module, provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip
Data Source
AI summary
The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.