Stacked Chip Power Module Layout for Shorter Current Paths
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Solution Overview
Problem
Existing data center power supply modules face challenges with high power consumption, increased space occupancy, and inefficiencies due to long current paths and high transistor counts, which result in significant energy losses.
Innovation Solution
An assembly structure that stacks a chip and a power converting module on a circuit board, with the power converting module being partially or fully embedded in a back plate or socket, reducing current path length and optimizing space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the power supply module is placed away from the processor chip to accommodate heat sink space, then the heat sink can be sufficiently large, but the current path becomes long causing increased energy losses
Solution Approach 1:
The patent transitions from a planar layout to a three-dimensional stacked architecture. The power supply module is positioned vertically below the processor chip through a back plate, creating a vertical current path that bypasses the horizontal distance constraints. This dimensional change allows the power module to be physically close to the chip's electrical contacts while maintaining adequate horizontal space for heat dissipation structures.
Solution Approach 2:
The back plate is designed to be inserted into the socket structure, creating a nested configuration where the power supply module integrates within the existing socket assembly. This nesting allows the power module to occupy space within the socket's vertical envelope, reducing the need for additional horizontal space and enabling closer proximity to the chip's power contacts.
2Reliability
If additional structural members (socket, clip, support plate, back plate, screw) are used to fix the processor chip, then reliable connections are ensured, but much space around the chip is occupied
Solution Approach 1:
The back plate integrates multiple functions into a single component: it serves as the mounting structure for the power supply module, provides electrical connection pathways, and acts as part of the chip fixation mechanism. By merging these previously separate functions (power module housing, connection interface, and mechanical support) into one integrated back plate assembly, the number of discrete structural members is reduced, freeing up space around the chip.
3Loss of energy
If the power supply module is placed close to the processor chip, then the current path is shortened reducing energy losses, but the heat sink space is reduced
Solution Approach 1:
The solution resolves this contradiction by utilizing the vertical dimension. The power supply module is positioned directly below the chip in the vertical axis, creating a short current path through the back plate. Meanwhile, the horizontal plane remains available for heat sink structures, allowing adequate heat dissipation surface area while maintaining minimal electrical path length between power contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes energy losses, reduces space occupancy, and enhances power density by shortening current paths and integrating power supply components more efficiently.
Implementation Method 1
a first power converting module, provided with at least one power output terminal, where the first power converting module is electrically connected to the chip, converts a first electrical energy to a second electrical energy, and supplies the second electrical energy through the at least one power output terminal to the at least one electrical energy input terminal of the chip
Data Source
AI summary
The present disclosure provides an assembly structure for providing power for a chip and the assembly includes: a board; a chip, provided with at least one electrical energy input terminal; and a first power converting module, provided with at least one power output terminal, wherein the first power converting module is electrically connected to the chip, converts a first electrical energy to a second electrical energy, and supplies the second electrical energy through the at least one power output terminal to the at least one electrical energy input terminal of the chip, and a back plate; wherein the back plate and the chip are provided at two opposite sides of the board; wherein the board, the chip and the first power converting module are stacked and the first power converting module is at least partially inserted in the back plate.