Stacked Chip Package Dam Structure Against Resin Intrusion

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Solution Overview

Problem

Semiconductor packages face challenges in maintaining reliability and efficiently arranging multiple semiconductor chips in limited space while preventing damage from resin intrusion during molding, which can cause mechanical stress and physical damage to the chips.

Innovation Solution

Incorporating a dam structure with dummy bumps and wires in open edge regions of the semiconductor chips to block resin flow and prevent intrusion, thereby protecting the chips from mechanical stress and damage during the molding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple semiconductor chips are stacked in limited space to increase integration, then productivity and functionality are improved, but reliability deteriorates due to resin intrusion causing mechanical stress and physical damage to chips

Engineering Contradiction:

Improveintegration densityVSAvoidchip reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent divides the chip structure into distinct regions by introducing a dam structure that segments the open edge region from the molding resin flow path. This segmentation prevents resin intrusion into critical areas while maintaining the stacked chip configuration for high integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dam structure acts as an intermediary element between the molding resin and the semiconductor chips. It serves as a protective barrier that mediates the interaction between the resin flow and chip edges, preventing direct contact and potential damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If chips are arranged in open edge regions to optimize space, then area utilization is improved, but harmful factors increase due to resin intrusion causing mechanical stress

Engineering Contradiction:

Improvespace utilizationVSAvoidmechanical stress from resin

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The dam structure is positioned in advance to counteract the harmful effect of resin intrusion. By placing the dam structure along the edge region before molding, it creates a preliminary defense that prevents resin from reaching and stressing the chips during the molding process.

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The patent converts the potential harm of resin flow into a beneficial controlled process. The dam structure guides the resin flow in a predetermined path, transforming what could be a damaging uncontrolled intrusion into a controlled molding process that protects chip integrity.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS11961824B2Semiconductor package including stacked chip structure

Publication Date: 2024.04.16 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes; a package substrate including an upper surface with a bonding pad, a lower semiconductor chip disposed on the upper surface of the package substrate, wherein an upper surface of the lower semiconductor chip includes a connect edge region including a connection pad and an open edge region including a dam structure including dummy bumps, a bonding wire having a first height above the upper surface of the lower semiconductor chip and connecting the bonding pad and the connection pad, an upper semiconductor chip disposed on the upper surface of the lower semiconductor chip using an inter-chip bonding layer, and a molding portion on the package substrate and substantially surrounding the lower semiconductor chip and the upper semiconductor chip.