Stacked Logic Memory Chip Thermal Insulation via Resin Layer
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Solution Overview
Problem
The integration of a logic chip with memory chips in a semiconductor device leads to increased heat generation, which can cause malfunction or reliability deterioration of the memory chips due to insufficient heat management.
Innovation Solution
The implementation of a semiconductor device architecture that includes a redistribution layer with a resin layer of lower thermal conductivity between the logic chip and memory chips, along with the use of a spacer resin without fillers to enhance heat insulation, and a filler-containing sealing resin to improve thermal conductivity and structural strength, effectively increasing the distance between the logic chip and memory circuits to reduce heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a logic chip is integrated with memory chips in a stacked package, then functionality and memory capacity are improved, but heat generation increases causing memory chip malfunction and reliability deterioration
Solution Approach 1:
The patent introduces a resin layer as an intermediary substance between the logic chip and memory chips. This resin layer has lower thermal conductivity compared to the chips, creating a thermal barrier that reduces heat transfer from the logic chip to the memory chips, thereby protecting memory reliability while maintaining functional integration
Solution Approach 2:
The patent applies different materials with different thermal properties to different regions of the package. The resin layer is specifically positioned where heat transfer needs to be blocked, while other areas may use different materials optimized for their specific functions, creating a heterogeneous thermal management structure
2Reliability
If a resin layer with lower thermal conductivity is inserted between logic chip and memory chips, then heat transfer to memory chips is reduced, but device complexity increases
Solution Approach 1:
The resin layer serves multiple functions simultaneously: it acts as a thermal barrier to reduce heat transfer, provides mechanical bonding between chips, and fills the gaps between stacked components. By combining thermal management and structural functions in a single element, the patent avoids increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses memory chip malfunction and reliability deterioration by reducing heat transfer from the logic chip to the memory chips, enhancing the semiconductor device's performance and reliability.
Implementation Method 1
a resin layer of lower thermal conductivity between the logic chip and memory chips
Implementation Method 2
a filler-containing sealing resin to improve thermal conductivity and structural strength
Data Source
AI summary
A semiconductor device according to an embodiment includes a first memory chip having a first front surface and a first back surface and having a first memory circuit provided on the first front surface side; a second memory chip having a second front surface and a second back surface facing the first front surface, having a second memory circuit provided on the second front surface side, and being electrically connected to the first memory chip; and a logic chip having the first memory chip provided between the logic chip and the second memory chip, having a third front surface and a third back surface, having a logic circuit provided on the third front surface side, and being electrically connected to the first memory chip.