Stacked Semiconductor Chip Resin Film Layout for Wire Bond Clearance
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Solution Overview
Problem
The protrusion of the resin film from a large-sized semiconductor chip can interfere with the electrical connection between the semiconductor chip and the wiring board, reducing the yield and performance of the semiconductor device.
Innovation Solution
The resin film is designed to fit entirely within the inner region of the larger semiconductor chip by forming concave portions on its side faces, and the cutting process is conducted in two stages to ensure precise fitting without protrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a resin film is used to mount a large-sized semiconductor chip on a small-sized chip, then the mounting structure is achieved, but the resin film may protrude from the chip end and interfere with electrical connection
Solution Approach 1:
The resin film is divided into a body portion and a protruding portion, with the protruding portion specifically positioned to clear the bonding wire path. This segmentation allows the resin film to fulfill its mounting function while avoiding interference with electrical connections.
Solution Approach 2:
The resin film exhibits different spatial characteristics: the body portion provides adhesive support for the semiconductor chip, while the protruding portion is specifically shaped and positioned to avoid the bonding wire area. This local differentiation resolves the contradiction between mounting stability and electrical connection reliability.
2Area of stationary object
If the resin film protrudes from the chip end, then the mounting area is reduced, but the protrusion interferes with bonding wire connection
Solution Approach 1:
The protruding portion of the resin film acts as an intermediary element that occupies the space between the chip end and the bonding wire path. By being specifically positioned and shaped, it prevents direct interference while maintaining the compact mounting structure.
Solution Approach 2:
The resin film configuration extends into the vertical dimension with its protruding portion, allowing it to clear the bonding wire path in the vertical space rather than requiring a larger horizontal mounting area. This dimensional approach resolves the space conflict.
3Reliability
If the resin film is positioned to avoid protrusion, then electrical connection is maintained, but the mounting area increases
Solution Approach 1:
The resin film is designed with a dynamic spatial configuration where the protruding portion is positioned at a specific distance from the chip end. This dynamic positioning optimizes the balance between maintaining electrical connection reliability and minimizing the overall mounting area.
Solution Approach 2:
The distance between the chip end and the resin film protruding portion is optimized as a key parameter. By adjusting this parameter, the design achieves the optimal balance between preventing bonding wire interference and minimizing mounting area occupation.
Data Source
AI summary
According to one embodiment, a semiconductor device includes: a circuit board; a first semiconductor chip mounted on a face of the circuit board; a resin film covering the first semiconductor chip; and a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board. The resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips.