Stacked Chip Selection via Sequential Logic and Inductive Coupling
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Solution Overview
Problem
Existing methods for stacking semiconductor chips require complex identification processes, increased manufacturing costs, and high power consumption due to the need for unique chip identification numbers and extensive wire-bonding, limiting the number of stackable chips and complicating production control.
Innovation Solution
A cascade connection of components with sequential logic circuits that determine their internal states based on control signals, allowing for arbitrary stacking and selection without pre-assigned identification numbers, using inductive coupling for communication and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If unique chip identification numbers are assigned to each stacked chip, then chip selection and control become possible, but manufacturing complexity and cost increase
Solution Approach 1:
Each chip automatically determines its own stack position and generates its identification number through the sequential logic circuit, eliminating the need for external identification assignment. The chip serves itself by using the control signal sequence received from above to establish its identity.
Solution Approach 2:
The identification number assignment function is extracted from the manufacturing process and transferred to the operational phase. Instead of embedding IDs during manufacturing, the system generates IDs dynamically based on the control signal sequence, separating identification from fabrication.
2Reliability
If wire-bonding is used for power supply and communication between stacked chips, then electrical connection is established, but power consumption and manufacturing cost increase
Solution Approach 1:
The patent replaces wire-bonding (mechanical/electrical connection) with inductive coupling (electromagnetic field-based connection). This substitution eliminates the need for physical wire bonds while maintaining reliable electrical connection and communication between chips.
Solution Approach 2:
The patent introduces magnetic fields as an intermediary for power and signal transmission between chips. Instead of direct electrical contact through wires, energy and information are transmitted through magnetic coupling, reducing direct electrical connections.
3Productivity
If a fixed number of chips are stacked with predetermined identification numbers, then production control becomes possible, but adaptability to different stacking configurations is reduced
Solution Approach 1:
The identification numbers are made dynamic rather than static. Instead of being fixed during manufacturing, IDs are generated dynamically during operation based on the actual stack configuration and control signal sequence, allowing the system to adapt to different stacking scenarios.
Solution Approach 2:
The system changes the parameter of identification number from a fixed manufacturing attribute to a variable operational attribute. This allows the same physical chips to have different identification numbers depending on their position and the control sequence, enabling flexible reconfiguration.
4Reliability
If chip identification numbers are embedded during manufacturing, then unique identification is achieved, but additional manufacturing steps and cost are required
Solution Approach 1:
The system performs preliminary action by establishing the control signal sequence and stack configuration before generating identification numbers. This allows IDs to be determined based on the operational setup rather than requiring pre-embedding during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of electronic circuits with arbitrary capabilities by stacking an arbitrary number of components, reducing manufacturing costs and power consumption, and allowing for flexible addition or removal of components without redesign.
Implementation Method 1
a means for receiving a signal from a preceding device by electromagnetic induction
Data Source
AI summary
In the electronic circuit device with stacked plural components of the same function, this invention enables to select an arbitrary component among plural components by a control element, without setting pre-determined identification information in each component. By installing a sequential logic circuit in each component, and changing a state of the sequential logic circuit by control data transmitted from the component stacked in a preceding stage or the control element, the state of the controlled component is set to a state that accepts a selection made by the control element.