Stacked Memory Chip Wiring With Shield Lines for Low Bit-Line Coupling

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Solution Overview

Problem

Existing semiconductor memory devices face challenges in efficiently integrating memory cell arrays and sense amplifiers while minimizing coupling between bit lines and complementary bit lines, which affects signal interference and wire length.

Innovation Solution

The semiconductor memory device employs a stacked chips structure where memory cell arrays and sense amplifiers are positioned on different wafers, with bit lines and complementary bit lines extending in different layers and connected through efficient wire arrangements, including refracted lines and shield lines to reduce coupling and wire length.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If bit lines and complementary bit lines are arranged adjacent to each other in a stacked chip structure, then wire length is reduced, but coupling between bit lines and complementary bit lines increases causing signal interference

Engineering Contradiction:
Improvewire lengthVSAvoidsignal interference
Core Design Contradiction:
Length of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a shield line as an intermediary element positioned between bit lines and complementary bit lines. This shield line acts as a mediator that blocks electromagnetic coupling between adjacent bit lines, reducing signal interference while allowing the wires to maintain short lengths in the stacked chip structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes the vertical dimension in stacked chip architecture to arrange bit lines and complementary bit lines in different layers. By positioning these conductors in the vertical dimension rather than only in the planar dimension, the patent reduces coupling while maintaining efficient connections, as the vertical separation reduces electromagnetic interference compared to planar arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If memory cell arrays and sense amplifiers are integrated on the same chip, then device complexity is reduced, but coupling between bit lines and complementary bit lines increases

Engineering Contradiction:
Improveintegration structureVSAvoidsignal interference
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent segments the memory device into multiple stacked chips: a first chip containing memory cell arrays and a second chip containing sense amplifiers. This segmentation separates the functions of data storage and data detection into different physical locations, reducing coupling between bit lines and complementary bit lines while maintaining integrated device operation through vertical stacking.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces shield lines as intermediary elements between bit lines and complementary bit lines in the stacked configuration. These shield lines mediate the electromagnetic field interactions, blocking harmful coupling signals while allowing the segmented architecture to function as an integrated device.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If shield lines are added between bit lines and complementary bit lines, then signal interference is reduced, but device complexity increases

Engineering Contradiction:
Improvesignal interferenceVSAvoidwire arrangement
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the shield line function with existing bit line structures by positioning shield lines adjacent to bit lines in the same or different layers. This combining approach reduces the need for separate, complex shielding structures while effectively reducing signal interference through the stacked chip architecture.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP4546340B1Semiconductor memory device with stacked chips structure
Publication Date: 2026.04.22 SAMSUNG ELECTRONICS CO LTD
  • EP4546340B1 patent drawingFigure 1
  • EP4546340B1 patent drawingFigure 2
  • EP4546340B1 patent drawingFigure 3

AI summary

A semiconductor memory device may include a first chip including a first array matrix and a second array matrix adjacent to each other and including memory cells, and a second chip below the first chip, and including sense amplifiers configured to drive the memory cells, where first cell bit lines are in the first array matrix, and second cell bit lines are in the second array matrix, where first bit lines and first complementary bit lines are below the first array matrix, and second bit lines and second complementary bit lines are below the second array matrix, where the first bit lines and the second bit lines are connected to the first cell bit lines and the second cell bit lines, respectively, and where the first complementary bit lines and the second complementary bit lines are connected to the second cell bit lines and first cell bit lines, respectively.