Stacked-Chip Shielded Inductor Layout for Parasitic Coupling Control
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Solution Overview
Problem
The integration of inductors in integrated circuits is challenging due to their susceptibility to electromagnetic interference, which affects the performance of on-chip inductors.
Innovation Solution
A structure comprising two stacked chips with an inductor partially or fully located in the dielectric of each chip, surrounded by an electromagnetic shield structure that includes lower and upper shield portions with metal layers and vias stacked vertically in each chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inductors are integrated into ICs, then the capabilities of integrated circuits are expanded, but the inductors become susceptible to electromagnetic interference which impacts their performance
Solution Approach 1:
The patent introduces an electromagnetic shield structure as an intermediary element between the inductor and external electromagnetic sources. This shield acts as a mediator that blocks or redirects electromagnetic interference, protecting the inductor while maintaining its integrated circuit functionality. The shield is positioned around the inductor and connected to ground, creating a protective barrier that allows the inductor to operate reliably within the IC.
Solution Approach 2:
The electromagnetic shield is designed to counteract electromagnetic interference before it can affect the inductor's performance. By placing the shield around the inductor during the fabrication process, the system preemptively defends against harmful electromagnetic fields, noise, and crosstalk from surrounding circuit elements, thereby maintaining signal integrity and inductor performance.
2Reliability
If an electromagnetic shield structure is added around the inductor, then parasitic coupling is reduced, but the device complexity increases
Solution Approach 1:
The electromagnetic shield structure is merged with the existing IC fabrication process and substrate architecture. The shield utilizes the same substrate and integration techniques as the surrounding circuit elements, combining the shielding function with the existing device structure rather than adding a completely separate component. This reduces overall complexity while maintaining shielding effectiveness.
Solution Approach 2:
The shield structure serves multiple functions: it provides electromagnetic shielding for the inductor, acts as a ground reference, and can be integrated with existing substrate layers. This multi-functionality reduces the need for additional separate components, thereby managing device complexity while improving inductor reliability through reduced parasitic coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electromagnetic shield structure effectively reduces parasitic coupling from surrounding devices and substrates, improving the performance and isolation of the on-chip inductor.
Implementation Method 1
An electromagnetic shield structure is arranged around the inductor. The electromagnetic shield structure includes a lower shield portion extending at least partially through the first dielectric of the first chip and an upper shield portion extending at least partially through the second dielectric of the second chip.
Data Source
AI summary
A structure including a first chip and a second chip stacked over the first chip is provided. The first chip includes a first dielectric over a substrate. The second chip includes a second dielectric over the first dielectric. An inductor is arranged at least in part in the first dielectric of the first chip. An electromagnetic shield structure is arranged around the inductor. The electromagnetic shield structure includes a lower shield portion extending at least partially through the first dielectric of the first chip and an upper shield portion extending at least partially through the second dielectric of the second chip. The electromagnetic shield structure is formed in part in the BEOL metallization structure in each of the first chip and the second chip in a heterogenous integration process.