Stacked Semiconductor Package with Through-Electrode Heat Paths
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving improved heat dissipation characteristics while maintaining miniaturization, lightweight design, high performance, and high reliability, particularly in stacked semiconductor structures.
Innovation Solution
The proposed solution involves a stack semiconductor package design with a base chip, multiple semiconductor chips stacked on the base chip, and a sealing material, where the semiconductor chips include through electrodes and dummy pads on their backside for enhanced heat dissipation, along with a dummy pattern connecting the pads to facilitate efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor chips are stacked to achieve miniaturization and high capacity, then device density and integration are improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by stacking semiconductor chips vertically. Through electrodes are arranged in the central portion of each chip and extend through the stack, creating vertical heat conduction paths that utilize the third dimension (height) to dissipate heat away from the dense chip stack, resolving the contradiction between high device density and effective heat dissipation.
2Temperature
If through electrodes are arranged in the central portion of semiconductor chips, then heat dissipation path is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the heat dissipation function by dedicating the central portion of each chip specifically to through electrodes, separating this thermal management function from the peripheral areas used for active circuit elements. This segmentation allows the central region to be optimized for heat conduction without compromising the functionality of surrounding circuitry, while the standardized central positioning reduces manufacturing complexity compared to arbitrary placements.
3Temperature
If dummy pads and dummy patterns are added to the back side of chips, then heat dissipation and stress distribution are improved, but device complexity increases
Solution Approach 1:
The dummy pads and dummy patterns on the back side of the chips serve multiple functions simultaneously: they act as heat dissipation pathways conducting thermal energy away from the chip, provide mechanical stress distribution to reduce warpage and improve reliability, and maintain structural symmetry in the chip design. This multi-functionality justifies the additional structural elements by delivering multiple benefits from a single design feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves heat dissipation characteristics and manufacturing ease, enhancing the operating performance and reliability of the semiconductor package without increasing manufacturing costs.
Implementation Method 1
the first semiconductor chip includes through electrodes arranged in a central portion of the first semiconductor chip
Implementation Method 2
a dummy pattern connecting the upper dummy pads with each other on the back side
Data Source
AI summary
A stack semiconductor package including a base chip, at least two semiconductor chips stacked on the base chip, and a sealing material sealing the at least two semiconductor chips on the base chip may be provided. The at least two semiconductor chips may include an uppermost semiconductor chip and at least one under the uppermost semiconductor chip, the first semiconductor chip includes through electrodes at a central portion thereof along a first direction, the through electrodes arranged along a second direction perpendicular to the first direction, upper dummy pads on outer portions of a back side of the first semiconductor chip, the outer portions being a non-active surface of the first semiconductor chip and being at both sides of the central portion in the first direction, and a dummy pattern connecting the upper dummy pads with each other on the back side.