Stacked-Chip Thermal Vias and Heat Dissipation Layer
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Solution Overview
Problem
Thermal management in stacked-chip packaging is challenging due to the low thermal conductivity of protective layers, which hinders heat dissipation from the chip interior to the surrounding environment, potentially leading to performance drops, reduced reliability, or damage from excessive temperatures.
Innovation Solution
A semiconductor structure with a first chip having through silicon vias, a redistribution layer, and a heat sink thermally coupled to thermal vias and a heat dissipation layer, allowing for efficient heat transfer without being hindered by dielectric materials, and a manufacturing method involving wiring layers and bump pads for improved thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is used to cover the chip surface, then chip protection is improved, but thermal conductivity deteriorates
Solution Approach 1:
The protective layer is segmented into two functional parts: a dielectric layer for electrical insulation and protection, and a separate heat dissipation layer for thermal management. This segmentation allows each layer to perform its specific function without compromising the other, resolving the contradiction between protection and heat dissipation.
Solution Approach 2:
A heat dissipation layer is introduced as an intermediary between the dielectric layer and the thermal via. This intermediary layer provides a thermal conduction path that bypasses the low thermal conductivity of the dielectric material, enabling efficient heat transfer from the chip interior to the heat sink while maintaining the protective function of the dielectric layer.
2Speed
If through silicon vias are used for vertical conductive paths, then signal transmission speed is improved, but thermal management complexity increases
Solution Approach 1:
The through silicon vias are designed to serve multiple functions: electrical conduction for signal transmission and thermal conduction for heat dissipation. By making the TSVs multi-functional, the patent eliminates the need for separate thermal management structures, thereby reducing overall device complexity while maintaining high signal transmission speed.
Solution Approach 2:
The electrical and thermal conduction functions are merged into a single integrated structure using the through silicon vias. The same TSV infrastructure that provides short vertical electrical paths for high-speed signaling also provides thermal pathways when filled with thermally conductive materials, combining two critical functions into one element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency and operation reliability by creating a thermal conductive path through thermal vias, heat dissipation layers, and a heat sink, improving the performance and longevity of stacked-chip packages.
Implementation Method 1
the protective layer likewise hinders thermal conductance between the lower chip and the heat sink
Implementation Method 2
Existing stacked-chip packages usually include a heat sink, which is bonded to a lower chip using adhesives
Data Source
AI summary
A semiconductor structure includes a plurality of thermal vias and a heat dissipation layer disposed at a periphery of a back surface of a lower chip in a stacked-chip package. This arrangement improves solderability of a subsequently-bonded heat sink. Additionally, the thermal vias and the heat dissipation layer provide an improved thermal conduction path for enhancing heat dissipation efficiency of the semiconductor structure. A method for manufacturing the semiconductor structure is also provided.