Stacked Electronic Chips With Offset Substrate Connections
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Solution Overview
Problem
Existing electronic devices with stacked chips face challenges due to long electrical connection wires, which lead to electrical losses and sensitivity to electromagnetic effects, particularly when the wires are installed.
Innovation Solution
The electronic device design features a support substrate with first and second electronic chips stacked such that the second chip's rear face extends beyond the periphery of the first chip, allowing for shorter, mechanically resistant electrical connections between the chips and the substrate, with additional connections between the chips to increase link density and reduce wire length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chips are offset and connected by electrical connection wires, then electrical links can be established between chips and substrate, but wire length increases causing electrical losses and electromagnetic sensitivity
Solution Approach 1:
The patent transitions from planar wire-based connections to three-dimensional stacked chip architecture with vertical electrical connection elements. The second chip is positioned above the first chip with its rear face extending beyond the periphery, enabling direct vertical connections to the substrate through the first chip, thereby reducing connection path length and eliminating long wire issues.
Solution Approach 2:
The patent introduces intermediate electrical connection elements (solder balls, pillars, or through-vias) that serve as mediators between chips and substrate. These intermediate elements enable direct electrical contact without long wires, establishing reliable electrical links through vertical pathways rather than lateral wire connections.
2Reliability
If electrical connection wires are used to connect offset chips, then electrical links are established, but mechanical resistance is reduced
Solution Approach 1:
The patent replaces flexible wire-based mechanical connections with rigid electrical connection elements such as solder balls, pillars, or through-vias. These solid structural elements provide both electrical connectivity and enhanced mechanical strength, eliminating the mechanical weakness inherent in wire-based connections.
3Reliability
If wire-based connections are used, then electrical links can be established, but the number of electrical links is limited
Solution Approach 1:
The stacked chip architecture with the second chip extending beyond the first chip's periphery enables multiple vertical electrical connection pathways. This three-dimensional arrangement allows numerous electrical links to be established simultaneously through the intermediate connection elements, dramatically increasing connection density compared to planar wire-based approaches.
Data Source
AI summary
An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.