Stacked Electrostatic Chuck Electrodes to Prevent Helium Hole Arcing
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Solution Overview
Problem
The existing substrate supporting apparatuses face challenges with arching issues when high bias power is applied, leading to increased manufacturing costs and reduced processing efficiency due to the need for smaller helium supply holes, which complicates the manufacturing process.
Innovation Solution
A substrate supporting apparatus is designed with a dielectric body, a heat transfer medium supply hole, and a configuration of first and second electrostatic electrodes that are electrically connected and stacked, reducing impedance and voltage applied to the heat transfer medium supply hole, thereby preventing arching without the need for smaller holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the size of the helium supply hole is reduced, then the probability of arching is reduced and breakdown voltage is raised, but manufacturing cost is increased and processing difficulty is increased
Solution Approach 1:
The single electrostatic electrode is divided into multiple stacked electrostatic electrodes (first, second, and optionally third electrodes). This segmentation allows the voltage to be distributed across multiple layers, reducing the voltage burden on any single electrode and consequently lowering the breakdown voltage at the helium supply hole, preventing arching without requiring hole size reduction.
Solution Approach 2:
The patent transitions from a planar electrode configuration to a three-dimensional stacked configuration of multiple electrostatic electrodes. This dimensional change enables voltage distribution in the vertical direction, effectively reducing the electric field intensity at any single point and preventing arching while maintaining manufacturable hole dimensions.
2Productivity
If high bias power is applied to the electrostatic chuck, then processing efficiency is improved, but arching occurs in the helium supply hole
Solution Approach 1:
By segmenting the electrostatic electrode into multiple stacked layers, the patent enables application of high bias power while distributing the electrical stress. This segmentation prevents arching even at high power levels, allowing maintenance of high processing efficiency without reliability degradation.
Solution Approach 2:
The patent changes the electrical parameters by introducing multiple electrodes with different potential distributions. This parameter change allows high bias power to be applied while controlling the electric field distribution to prevent breakdown and arching in the helium supply hole.
3Device complexity
If a single electrostatic electrode is used, then device complexity is reduced, but arching occurs when high bias power is applied
Solution Approach 1:
The patent applies segmentation by dividing the electrostatic electrode into multiple stacked electrodes. While this increases structural complexity, it dramatically improves reliability by preventing arching. The segmented design is achieved through standardized manufacturing processes, keeping the increase in complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the risk of arching during high bias power applications, maintaining processing efficiency while minimizing manufacturing costs by allowing larger heat transfer medium supply holes, thus enhancing durability and productivity.
Implementation Method 1
a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode
Implementation Method 2
a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode... reducing impedance and voltage applied to the heat transfer medium supply hole
Data Source
AI summary
Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.