Stacked Circuit Board Module for Compact Earphone Design
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Solution Overview
Problem
True wireless earphones face challenges in reducing volume and improving space flexibility due to the inclusion of various electronic elements, making them bulky and heavy.
Innovation Solution
The design incorporates a circuit board module with a first and second circuit board connected by a flexible connector, where the second circuit board covers the first, reducing overall dimensions and using a flexible material to maintain thinness, along with a rigid-flex board configuration and conductive wires to minimize volume and material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If various electronic elements (circuit boards, batteries, antennas, microphones, speakers) are included in true wireless earphones, then the earphone can achieve wireless functionality, but the internal space is significantly occupied making the earphone bulky and heavy
Solution Approach 1:
The patent applies nesting by placing the second circuit board on the first circuit board, creating a stacked configuration where components are nested within the existing structure rather than arranged in a planar layout. This vertical stacking allows the earphone to maintain all necessary electronic elements while reducing overall footprint and volume.
Solution Approach 2:
The patent transitions from a traditional two-dimensional planar arrangement of circuit boards to a three-dimensional stacked configuration. By arranging circuit boards in layers (first circuit board at the bottom, second circuit board on top), the design utilizes the vertical dimension to accommodate components, thereby reducing the horizontal footprint and overall volume of the earphone.
2Device complexity
If circuit boards are arranged in a traditional planar configuration, then the layout is simple, but the length and width dimensions are larger reducing space flexibility
Solution Approach 1:
The patent resolves the contradiction by moving from a two-dimensional planar layout to a three-dimensional stacked arrangement. The first circuit board and second circuit board are positioned in different vertical layers, allowing the earphone to maintain a compact footprint while accommodating all necessary electronic elements. This dimensional transition directly reduces the length and width dimensions without significantly increasing layout complexity.
3Stability of the object's composition
If rigid circuit boards are used for structural stability, then the connection is stable, but the flexibility for space arrangement is reduced
Solution Approach 1:
The patent introduces a flexible connector that bridges the first circuit board and second circuit board. This flexible connector allows the circuit boards to maintain their rigid structural stability for electrical connectivity while enabling flexible spatial arrangement. The flexible connector can accommodate variations in positioning and bending, providing adaptability for different space configurations without compromising the stability of the circuit board connections.
Data Source
AI summary
An earphone with a circuit board module includes a casing, a speaker, and a circuit board module. The casing includes a back cover and has an accommodation space inside. The speaker is disposed in the accommodation space, and a first chamber is defined between the speaker and the back cover. The circuit board module is disposed in the first chamber and includes a first circuit board having a first surface, a second circuit board having a second surface, and a first flexible connector. The first surface faces and is spaced apart from the second surface of the second circuit board. The first flexible connector includes a first end connected to the first circuit board, a second end which is opposite to the first end and connected to the second circuit board, and a connection segment which connects the first and second ends and is shaped as a letter U.