Stacked Circuit Board Module Edge Support and Test Points

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Solution Overview

Problem

Current packaging techniques for miniaturized image reader modules are inadequate for achieving the required level of miniaturization and lack suitable test points for verification and calibration during the manufacturing process, with existing methods either consuming valuable space or providing insufficient structural integrity.

Innovation Solution

A packaging technique involving circuit boards with notches and supports, such as flex cables or bus bars, that are soldered into these notches to provide both structural support and electrical connectivity, forming test points for verification and calibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If support posts pass directly through apertures within the boards to provide structural integrity, then structural support is achieved, but valuable real estate within the module is taken up

Engineering Contradiction:

Improvestructural integrityVSAvoidmodule area

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

The patent transitions from through-aperture support posts (occupying Z-axis space) to edge-mounted support structures (utilizing board perimeters). This dimensional repositioning allows structural support without consuming central module area, enabling better space utilization for functional components.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Strength

If connector rods are used to interconnect circuit boards with structural integrity, then structural support is provided, but test points for manufacturing verification are not included

Engineering Contradiction:

Improvestructural integrityVSAvoidtesting capability

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent combines structural support function and electrical test function into a single integrated structure. The support posts serve dual purposes: providing mechanical stability between boards and acting as electrical test points for manufacturing verification, eliminating the need for separate test structures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The support structure is designed to perform multiple functions simultaneously: structural support, electrical connectivity, and manufacturing test points. This multi-functionality reduces overall device complexity and component count while maintaining all necessary capabilities.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If flex cables are used to connect circuit boards, then electrical connectivity is achieved, but structural integrity is not provided and significant space is consumed

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmodule area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts the structural support function from the flex cable system and assigns it to dedicated support structures. This separation allows the flex cables to be minimized to only the necessary electrical connection function, reducing cable length and occupied space while structural integrity is maintained by the support posts.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If interconnect ribbons are used for board connection, then electrical connectivity is provided, but they become worn and need replacing before final shipping

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmaintenance requirement

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The patent implements rigid support structures and stabilized mounting methods that prevent excessive movement, stress, and wear on interconnect elements during assembly and operation. This preventive design approach eliminates the wear issues that plague flexible ribbon cables by providing mechanical protection and stable positioning from the outset.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS7483561B2Miniaturized imaging module construction technique

Publication Date: 2009.01.27 PSION TEKLOGIX

AI summary

A method of constructing an image reader module and the image reader are described. The image reader module includes two or more circuit boards in a stacked configuration. Corresponding notches for receiving supports are formed along adjacent edges of the boards, which also have electrical contact points at the edges of each board connected to circuits on the boards. The supports are mounted in the notches between the two or more circuit boards to structurally interconnect the boards. Each of the supports, which may be flex cables or conductive bus bars, have one or more electrical conductors that are electrically connected to the contact points on the boards to electrically interconnect the boards, whereby the connections between the electrical conductors and the contact points form test points for the module. The notches may be substantially rectangular to receive the flex cable or may be slots to receive a bus bar. One end of the structural support flex cable or bus bar may be flush with one of the circuit boards and the other end of the structural support may extend past another one of the circuit boards. The supports may be soldered to the edges of the boards within the notches, which may be initially plated. In the image reader module an image sensor may be located on one of the circuit boards and an illumination assembly may be located on another of the circuit boards.