Stacked Circuit Board Design for Compact Endoscope Imaging
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Solution Overview
Problem
Existing endoscope designs face challenges in reducing the size and load of the distal end portion while preventing short circuits between components, which can lead to failures.
Innovation Solution
The design incorporates a first and second circuit board with electrode pads and vias, along with connecting members, where dummy pads on the second board overlap with electronic components, and mounting lands are connected through a predetermined path including vias and wirings, allowing for reduced size and minimized risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the diameter and length of the distal end portion are reduced to decrease load on the subject, then the size is reduced, but the risk of short circuits between components increases
Solution Approach 1:
The patent transitions from a two-dimensional circuit board layout to a three-dimensional stacked configuration with multiple circuit boards arranged in the vertical direction. This allows components to be distributed across different layers (first circuit board, second circuit board, third circuit board) while maintaining compact horizontal footprint, thus reducing the overall distal end portion size without increasing short circuit risk.
Solution Approach 2:
The patent divides the circuit board into multiple separate boards (first, second, and third circuit boards) with distinct functional regions. Electronic components are segmented and mounted on specific boards based on their functions, with dummy pads strategically placed on the second circuit board to prevent short circuits while maintaining electrical connectivity through controlled pathways.
2Quantity of substance
If finer connection pitches and reduced mounting spaces are used to increase packaging density, then packaging density is improved, but the risk of short circuits between components increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple circuit boards with connecting members (such as bumps or solder joints) to achieve high packaging density. This three-dimensional arrangement allows finer connection pitches without increasing short circuit risk, as the vertical separation provides natural isolation between components on different layers.
Solution Approach 2:
The patent introduces dummy pads as intermediary elements on the second circuit board. These dummy pads act as buffer zones that prevent direct contact between conductive elements from different layers, thereby mediating the connection process and reducing short circuit risk while maintaining high packaging density through efficient space utilization.
3Volume of moving object
If dummy pads are placed to overlap with electronic components for compact layout, then space is saved, but short circuits may occur between the dummy pads and components
Solution Approach 1:
The patent resolves the overlap conflict by placing dummy pads on the second circuit board while mounting electronic components on the first and third circuit boards in the vertical stack. This three-dimensional arrangement allows projected overlap in the horizontal plane without actual physical contact, saving layout space while preventing short circuits through vertical separation.
Solution Approach 2:
The patent applies local quality by creating non-conductive regions or insulation structures between the dummy pads on the second circuit board and the electronic components on adjacent boards. This localized insulation allows the dummy pads to be positioned in overlapping projections without creating conductive pathways, thus maintaining compact layout while ensuring reliability.
Data Source
AI summary
A disclosed electronic circuit unit includes a first circuit board in which first electrode pads, mounting lands and second electrode pads are formed and that has vias and wirings; a second circuit board in which third electrode pads and dummy pads are formed and that has vias and wirings; and electronic components that are connected to the mounting lands. When the dummy pads are projected in the direction orthogonal to a surface, one of the dummy pads is overlapped one of electrodes of one of the electronic components. The mounting lands for the electronic components overlapping the dummy pads at the time of the projection are connected to, by connecting members, the second electrode pads, the wirings, and the like, the dummy pads connected to the third electrode pads by the wirings or the like.