Stacked Secondary Circuit Board Layout for Compact Electronics
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Solution Overview
Problem
The increasing number and size of electronic components in miniaturized electronic devices, such as mobile phones and notebook computers, leads to a lack of design space and complicates electrical layout and connection, particularly when components like cameras, speakers, or vibration motors require more internal space.
Innovation Solution
A stacked connection structure is formed by a primary circuit board and two secondary circuit boards, where the second secondary circuit board overlaps the first secondary circuit board, connected via different electrical connectors, allowing for a three-layered circuit board arrangement that optimizes space usage and minimizes staggered connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are increased in quantity and size to meet performance requirements, then device functionality is improved, but internal space becomes insufficient and design complexity increases
Solution Approach 1:
The patent transitions from a traditional planar layout to a three-dimensional stacked configuration. Multiple circuit boards (primary circuit board, first secondary circuit board, and second secondary circuit board) are arranged in overlapping layers, utilizing the vertical dimension to accommodate more components without increasing the device's footprint. This dimensional transition directly resolves the space constraint while maintaining component functionality.
2Quantity of substance
If components are arranged in a staggered layout to fit more elements, then component quantity is improved, but electrical layout and connection difficulty increases
Solution Approach 1:
The patent merges multiple circuit boards into a stacked configuration where they overlap in the vertical direction. This consolidation allows multiple boards to occupy the same horizontal footprint while maintaining separate electrical connections through the stacking structure. The merging approach simplifies the overall electrical layout compared to staggered arrangements, as connections are made through standardized interfaces between stacked layers rather than complex lateral routing.
3Area of stationary object
If circuit boards are stacked in overlapping layers, then space utilization is improved, but connection reliability must be maintained
Solution Approach 1:
The patent segments the electrical connection system into multiple independent connection interfaces between stacked circuit boards. Each interface (first electrical connector between primary and first secondary board, second electrical connector between primary and second secondary board) operates independently, allowing for localized connection management. This segmentation enables reliable connections despite the compact stacked arrangement, as each connection point can be optimized separately rather than requiring a single complex connection system.
Data Source
AI summary
An electronic assembly includes a first electronic component, a second electronic component, and a primary circuit board. The first electronic component is provided with a first secondary circuit board, the second electronic component is provided with a second secondary circuit board, the first secondary circuit board is electrically connected to the primary circuit board by using a first electrical connector, interlayer space is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board by using a second electrical connector, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board.