Stacked Anti-Interference Circuit Board for Magnetometer Layout
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Solution Overview
Problem
In mobile phone architecture, magnetic interference complicates the layout of magnetometers, making it difficult to find locations with minimal interference, leading to reduced space for other electronic devices on the anti-interference circuit board due to conventional compensation methods.
Innovation Solution
An anti-interference circuit board with a multi-layer substrate featuring functional circuits that generate magnetic fields in specific directions to cancel interference, allowing these circuits to be stacked beneath the magnetometer without occupying surface space, thus optimizing layout and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If coils are disposed on two sides of the magnetometer on the anti-interference circuit board to perform compensation, then magnetic interference to the magnetometer is reduced, but the area occupied on the circuit board increases and space for other electronic devices is reduced
Solution Approach 1:
The patent transitions from planar coil arrangement to three-dimensional stacked functional circuits. The first and second functional circuits are disposed on different layers of the multi-layer substrate, utilizing the vertical dimension to achieve magnetic field compensation without occupying additional surface area. This dimensional transition resolves the contradiction by enabling interference compensation while preserving layout space.
Solution Approach 2:
The patent embeds the functional circuits within the multi-layer substrate structure, nesting the compensation functionality inside the board itself rather than placing it on the surface. The first and second functional circuits are integrated into different layers of the substrate, creating a nested configuration that eliminates the need for separate surface-mounted coils.
2Object-affected harmful factors
If conventional coil-based compensation is used, then magnetic interference is compensated, but the device complexity and layout difficulty increase
Solution Approach 1:
The patent merges the magnetic field compensation function with the existing multi-layer substrate structure. The first and second functional circuits are integrated into the substrate layers rather than being separate components, combining the compensation functionality with the board structure itself. This merging simplifies the overall device complexity and reduces layout difficulty.
Solution Approach 2:
The multi-layer substrate serves multiple functions: it provides structural support, enables signal routing through its circuit layers, and houses the magnetic field compensation functionality through the first and second functional circuits. This multi-functionality eliminates the need for separate compensation components, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cancels magnetic interference in multiple directions, allowing for a more compact and efficient layout of electronic devices on the circuit board by using stacked functional circuits that generate perpendicular magnetic fields, thereby enhancing the operating environment of magnetometers.
Implementation Method 1
the first functional circuit is configured to generate a magnetic field in a first direction
Implementation Method 2
the second functional circuit is configured to generate a magnetic field in a second direction
Implementation Method 3
the magnetic field generated in the first direction and the magnetic field generated in the second direction are used to cancel magnetic interference to the electronic device
Data Source
AI summary
An anti-interference circuit board and a terminal, where the anti-interference circuit board includes a substrate having a first surface and a first region for placing a magnetometer is disposed on the first surface. A plurality of circuit layers are disposed in the substrate in a stacked manner. The first functional circuit and the second functional circuit are disposed to compensate for interference to the magnetometer in the first region, and during disposing, the first functional circuit and the second functional circuit are located below the magnetometer to reduce an occupied surface area of the anti-interference circuit board.