Stacked Circuit Board Assembly With Integrated Metal Shielding Frame
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Solution Overview
Problem
Existing EMI-resistant circuit board designs are complex, expensive, and inefficient in space utilization due to the need for multiple metal shielding masks that do not align with high-frequency circuit regions, leading to increased product size and reduced circuit functionality.
Innovation Solution
A stacked circuit board assembly with a metal shielding frame sandwiched between adjacent circuit boards, where the shielding frame is electrically connected to ground potential to guide high-frequency noises to ground, minimizing space occupation and enhancing EMI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple metal shielding masks are used to cover high-frequency circuit regions, then electromagnetic interference protection is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges multiple separate metal shielding masks into a single integrated metal shielding frame that surrounds multiple high-frequency circuit regions. Instead of placing individual shielding masks over each high-frequency circuit region, the invention uses one continuous shielding frame that provides EMI protection for multiple regions simultaneously, thereby reducing structural complexity and manufacturing cost while maintaining electromagnetic interference protection
Solution Approach 2:
The metal shielding frame serves multiple functions: it provides EMI shielding for multiple high-frequency circuit regions, acts as a structural support element, and provides a common ground reference. This multi-functional design eliminates the need for separate shielding masks for each circuit region, reducing overall device complexity while maintaining protection against electromagnetic interference
2Object-affected harmful factors
If multiple metal shielding masks are used for each high-frequency circuit region, then EMI protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple individual shielding masks into a single integrated metal shielding frame structure. This consolidation reduces the number of separate components that need to be manufactured and assembled, thereby lowering manufacturing costs while maintaining comprehensive EMI protection across all high-frequency circuit regions
Solution Approach 2:
The single metal shielding frame provides universal EMI protection for multiple high-frequency circuit regions simultaneously. This multi-functional approach eliminates the need to manufacture and assemble multiple separate shielding masks, significantly reducing manufacturing complexity and cost while maintaining effective electromagnetic interference protection
3Device complexity
If high-frequency circuit regions are arranged together to use a single metal shielding mask, then manufacturing complexity is reduced, but circuit space utilization deteriorates
Solution Approach 1:
The metal shielding frame is designed with local openings or cutouts that correspond to the specific layouts of high-frequency circuit regions. This allows the shielding structure to adapt to the actual circuit arrangement, providing EMI protection only where needed while leaving other areas open for circuit placement, thereby optimizing space utilization without compromising shielding effectiveness
4Device complexity
If high-frequency circuit regions are arranged together with a single metal shielding mask, then manufacturing is simplified, but product size increases
Solution Approach 1:
The patent merges multiple separate shielding masks into a single integrated metal shielding frame that surrounds multiple high-frequency circuit regions. This consolidation reduces the overall space required for shielding structures, as the single frame shares walls and boundaries among multiple regions, thereby reducing product size while maintaining manufacturing simplicity
Solution Approach 2:
The metal shielding frame is designed to nest around multiple high-frequency circuit regions in a compact arrangement. The frame structure efficiently encloses multiple regions by sharing common boundaries, creating a nested-like configuration that minimizes the total volume occupied by shielding structures while keeping the design simple to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces product size, optimizes circuit design space, and prevents electromagnetic interference while maintaining signal transmission integrity, allowing for efficient expansion in the vertical direction without increasing surface area.
Implementation Method 1
The metal shielding frame is electrically connected to a ground potential of the circuit boards and shields the at least one high-speed device to guide the produced high-frequency noises to the ground potential
Data Source
AI summary
An EMI-resistant circuit board assembly includes a plurality of circuit boards arranged in a stack and a metal shielding frame respectively sandwiched in between each two adjacent circuit boards. One of the circuit boards has at least one high-speed device producing high-frequency noises to the ambient, which result in EMI effect. The metal shielding frame is electrically connected to the ground potential of the circuit boards and shields the high-speed device on the circuit board to guide the high-frequency noises to the ground potential.