Stacked Circuit Board Structure for Thin, Reliable Connections
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Solution Overview
Problem
The challenge is to manufacture a lighter, smaller, and thinner circuit board with high reliability to meet the demand for fast speed, high performance, and multiple functions in electronic products.
Innovation Solution
A method involving a composite material film with a metal and polymeric film, a dielectric layer, and a release film, where the dielectric layer is directly bonded to a substrate and patterned to form conductive blind holes for electrical connections, using plasma etching and deposition of conductive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If the circuit board is made thinner and lighter to meet scaling-down demands, then the size and weight are reduced, but the reliability and structural integrity deteriorate
Solution Approach 1:
The patent employs a composite material film consisting of a polymeric film and a metal film layered together. The polymeric film provides lightweight properties and structural support, while the metal film provides electrical conductivity and mechanical strength. This composite structure enables the circuit board to be thinner and lighter while maintaining or improving reliability through the synergistic combination of materials with complementary properties.
2Length of stationary object
If the circuit board is made thinner to reduce size, then the thickness is reduced, but the manufacturing precision and damage resistance deteriorate
Solution Approach 1:
The patent applies a protective coating layer on the circuit board surface before bonding the stacked structure. This preliminary protective action prevents damage to the thin circuit layers during subsequent manufacturing processes and assembly operations. The coating acts as a buffer that absorbs mechanical stresses and prevents direct contact between sharp edges or abrasive surfaces and the fragile circuit layers, thereby maintaining manufacturing precision despite reduced thickness.
Solution Approach 2:
The composite material film structure provides enhanced mechanical strength to compensate for the reduced thickness. The metal film within the composite structure reinforces the polymeric film, creating a layered architecture that resists bending, cracking, and other forms of damage. This composite construction allows the circuit board to be thinner while maintaining the structural integrity needed for precise manufacturing.
3Ease of manufacture
If conventional bonding methods are used to bond the stacked structure, then the bonding process is simple, but the reliability of electrical connections deteriorates
Solution Approach 1:
The patent introduces a bonding layer as an intermediary between the substrate and the stacked structure. This bonding layer serves as a mediator that ensures reliable adhesion and electrical connection. The bonding layer is specifically designed to facilitate strong bonding while maintaining electrical conductivity, thereby improving the reliability of electrical connections without significantly complicating the bonding process. It acts as a functional interface that reconciles the requirements for strong mechanical bonding and reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability of the circuit board by reducing damage to circuit layers and allowing for smaller thicknesses while maintaining electrical connectivity.
Implementation Method 1
plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer
Implementation Method 2
depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the at least one contact pad
Data Source
AI summary
A stacked structure for circuit board includes a composite material film, a dielectric layer, and a release film. The composite material film includes a metal film and a polymeric film. The dielectric layer is disposed on the composite material film and directly contacts the polymeric film. The release film is disposed on the dielectric layer and directly contacts the dielectric layer.