Stacked Circuit Board Assembly With Support Element for Signal Integrity

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Solution Overview

Problem

Existing multi-board assemblies with high-speed connectors face mechanical tolerance issues, leading to incomplete mating or insufficient contact due to low wipe lengths, resulting in signal attenuation and reduced signal integrity.

Innovation Solution

Incorporating a support element with a central member and board fixing features that secure daughter boards directly to the main board, reducing mechanical tolerance and allowing direct inter-board connections with high-speed connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high-speed connectors with low wipe lengths are used in multi-board assemblies, then signal integrity is improved, but mechanical tolerance issues cause incomplete mating or insufficient contact

Engineering Contradiction:
Improvesignal integrityVSAvoidmechanical tolerance
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The support element is divided into a central member and multiple board fixing features, allowing independent positioning and securing of multiple circuit boards. This segmentation enables precise control of mechanical tolerances for each board connection point, ensuring reliable connector mating while maintaining signal integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support element acts as an intermediary component between multiple circuit boards, providing a stable reference structure that mediates the mechanical tolerance issues. By fixing daughter boards to the support element rather than directly to each other or to the main board, the system achieves better positional accuracy and connector contact reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If daughter boards are directly mounted to the main board, then assembly complexity is reduced, but mechanical tolerance accumulation degrades connector contact quality

Engineering Contradiction:
Improveassembly structureVSAvoidconnector contact precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The assembly structure is segmented by introducing a support element as an intermediate carrier. Instead of direct mounting of daughter boards to the main board, each daughter board is mounted to the support element, creating separate mounting stages that prevent tolerance accumulation and improve connector contact precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support element adds a new dimensional layer to the assembly hierarchy, positioning itself between the main board and daughter boards in the vertical dimension. This intermediate layer provides an additional reference plane that improves positional accuracy without significantly increasing overall assembly complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If multiple circuit boards are stacked closely for compact assembly, then space utilization is improved, but mechanical stability and signal integrity are compromised

Engineering Contradiction:
Improveassembly footprintVSAvoidsignal integrity
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The support element segments the stacked assembly into distinct sections, with each daughter board independently positioned and secured. This segmentation maintains compact vertical stacking for space efficiency while ensuring each board has stable mechanical support, preventing signal integrity degradation from poor contact.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support element merges multiple functions into a single component: providing mechanical support, establishing electrical connections, and maintaining positional stability for multiple daughter boards simultaneously. This consolidation enables compact stacking while preserving signal integrity through reliable, stable connections.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12432855B2Multiple circuit board assembly including a support element and method of manufacture thereof
Publication Date: 2025.09.30 SANDISK TECHNOLOGIES LLC
  • US12432855B2 patent drawing
  • US12432855B2 patent drawing
  • US12432855B2 patent drawing

AI summary

Systems and methods are described for assembling multiple circuit boards using support elements to provide a stacked circuit board assembly. A support element is mounted to a first (e.g., main) circuit board, and a pair of additional circuit boards (e.g., daughter boards) are mounted to the support element on two opposite sides of the first circuit board to provide a stacked circuit board assembly.