Stacked Electronic Circuit Packaging for Heat Dissipation
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Solution Overview
Problem
Existing electronic circuits face challenges in heat dissipation due to resin encapsulation, leading to performance limitations and potential failure from excessive heating, particularly in stacked configurations.
Innovation Solution
The electronic circuit design incorporates an upper and lower substrate with an integrated chip, a first region of high thermal conductivity material between the chip and a heat transfer area, and a second region filled with a lower conductivity material, featuring conductive elements and a heat conductor to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic circuits are embedded in resins by molding process to protect from environmental conditions, then protection from humidity is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent divides the encapsulation space into two distinct regions: a first region filled with high thermal conductivity material (≥1.0 W/mK) for heat dissipation, and a second region filled with standard resin material for environmental protection. This segmentation allows each region to perform its specific function optimally without compromising the other.
Solution Approach 2:
The patent applies different material properties to different spatial locations: the first region near the heat-generating components uses high thermal conductivity material, while the second region uses standard protective resin. This local differentiation ensures that heat dissipation needs are met where required, while maintaining overall environmental protection.
2Volume of moving object
If mold embedded package assemblies are used to make electronic circuits more compact, then circuit compactness is improved, but heat dissipation deteriorates
Solution Approach 1:
The compact molded package is segmented into functional zones: a heat dissipation zone (first region) and a protective encapsulation zone (second region). This enables the compact structure to simultaneously achieve space efficiency and thermal management through differentiated material placement.
Solution Approach 2:
The patent uses composite material strategy by combining high thermal conductivity material with standard resin material in a single encapsulation structure. This composite approach allows the package to exhibit both compactness and effective heat dissipation properties within the same volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation, reducing the risk of hot spots and failures by effectively transferring heat away from the chip, enhancing circuit performance.
Implementation Method 1
a first region made of a first material and arranged between the chip and a heat transfer area crossing the lower substrate... the first material has a thermal conductivity greater than a thermal conductivity of the second material
Implementation Method 2
the heat transfer area comprises a heat conductor arranged in the opening and having a greater thermal conduction than the second material
Implementation Method 3
first heat conduction elements are arranged between the upper and lower substrates, with the first heat conduction elements fastened to the upper and lower substrates
Data Source
AI summary
An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.