Stacked Circuit Module Heat Path for Sealed Component Cooling
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Solution Overview
Problem
Existing semiconductor device packages face challenges in effectively releasing heat generated between the first and second substrates to the outside.
Innovation Solution
A circuit module design incorporating an upper and lower circuit board with a heat conduction member and heat dissipation members, where the heat conduction member overlaps the heat-generating component and is coupled to conductor layers, allowing heat to be transferred and dissipated through exposed heat dissipation members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are mounted between the upper and lower circuit boards, then the functionality of the circuit module is improved, but heat accumulation occurs which deteriorates the reliability of the device
Solution Approach 1:
A heat conduction member is introduced as an intermediary between the heat-generating component and the heat dissipation member. This mediator efficiently transfers heat from the component to the dissipation structure, resolving the heat accumulation problem while maintaining component functionality.
Solution Approach 2:
The heat dissipation member extends in a direction orthogonal to the up-down axis (horizontal dimension), providing an additional heat dissipation pathway that does not interfere with the vertical stacking of circuit boards and components.
2Temperature
If heat dissipation structures are added to the circuit module, then heat release capability is improved, but the device complexity increases
Solution Approach 1:
The heat conduction member and heat dissipation member are integrated into a unified thermal management structure. The heat conduction member directly contacts the component and the heat dissipation member, combining heat conduction and heat dissipation functions into a compact assembly that minimizes structural complexity.
Solution Approach 2:
The conductor layer serves multiple functions: it provides electrical connectivity and simultaneously acts as a thermal pathway to conduct heat from the component to the heat dissipation member, reducing the need for separate dedicated heat conduction structures.
3Reliability
If the heat dissipation member is fully enclosed in the sealing resin, then the sealing and protection are improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
A portion of the heat dissipation member is extracted from the sealing resin and exposed on the outer surface. This allows the exposed portion to directly dissipate heat to the external environment, maintaining effective heat dissipation while the sealed portion continues to provide structural support and protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient heat dissipation is achieved by transferring heat generated between the upper and lower circuit boards to the outside of the module, enhancing thermal management.
Implementation Method 1
a heat conduction member 40, a first conductor layer 42a to 42d, and a heat dissipation member 44a to 44d... the heat conduction member 40 overlaps the first component 26 as viewed in a downward direction... is directly coupled to the first conductor layer 42a to 42d or is coupled to the first conductor layer 42a to 42d via a conductor
Implementation Method 2
a part of the heat dissipation member 44a to 44d is exposed from the first sealing resin 18 in a direction orthogonal to an up-down axis
Implementation Method 3
a part of the heat dissipation member 44a to 44d is exposed from the first sealing resin 18 in a direction orthogonal to an up-down axis
Data Source
AI summary
A first sealing resin is disposed between a first lower main surface and a second upper main surface. An upper circuit board first mounting electrode is disposed on the first lower main surface. A lower circuit board first mounting electrode is disposed on the second upper main surface. A first component is mounted on the lower circuit board first mounting electrode and is disposed in the first sealing resin. A first conductor layer is disposed on an upper circuit board. As viewed in the downward direction, a heat conduction member overlaps the first component, is disposed in a space between the first lower main surface and the second upper main surface, and is coupled to the first conductor layer via a conductor. A part of a heat dissipation member is exposed from the first sealing resin in a direction orthogonal to an up-down axis.