Stacked Circuit Module Submodules Conductive Interconnect

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Solution Overview

Problem

Conventional circuit module manufacturing methods require significant board space and are complex and costly due to the side-by-side arrangement of submodules, which limits efficiency and scalability.

Innovation Solution

A three-dimensional circuit module design featuring stacked submodules interconnected by a conductive structure, allowing for reduced board space occupation and simplified mass production by enabling simultaneous manufacturing of multiple modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If submodules are arranged side by side in conventional circuit modules, then manufacturing is simpler, but board space occupation increases

Engineering Contradiction:

Improveboard space occupationVSAvoidmodule structure complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked arrangement of submodules. Multiple submodules are vertically stacked and interconnected through conductive structures, enabling compact integration while reducing the horizontal footprint on the circuit board.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested configuration where submodules are stacked one on top of another, with smaller components and conductive structures nested within and between the submodules. This nested doll approach maximizes space utilization by placing functional elements in multiple hierarchical levels.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

If multiple circuit modules are manufactured separately, then manufacturing precision is maintained, but productivity decreases

Engineering Contradiction:

Improvemanufacturing throughputVSAvoidalignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent combines multiple circuit modules into a single integrated package by stacking submodules vertically and interconnecting them with conductive structures. This merging allows multiple functional units to be manufactured and assembled together as one cohesive component, improving productivity while maintaining precision through unified design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The stacked submodule architecture creates a universal building block that can be replicated and stacked to form multiple circuit modules simultaneously. The standardized interface and conductive structure design enable multi-functionality, where the same basic unit serves multiple purposes across different modules, simplifying mass production.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9171823B2Circuit module with multiple submodules

Publication Date: 2015.10.27 STMICROELECTRONICS INT NV

AI summary

An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.