3D Stacked Circuit Modules for Compact Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional circuit design methods are limited by 2D printed circuit boards, restricting flexibility in size and space, and require extensive use of wires and soldering pins, making it difficult to adapt to small-sized products and limiting design freedom.
Innovation Solution
A method for stacked connection of isolated circuit components without PCBs or wires, using modular components with bonding pads for direct soldering, allowing for 3D circuit design and assembly as building blocks, enabling flexible and compact circuit creation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional PCB-based circuit design is used, then circuit stability and ease of manufacture are improved, but circuit flexibility and adaptability to small sizes deteriorate
Solution Approach 1:
The patent transitions from 2D PCB layout to 3D stacked connection, allowing circuits to be built vertically by stacking multiple isolated circuit components. This dimensional change enables compact circuits suitable for small-sized products while maintaining manufacturing feasibility through standardized stacking processes.
Solution Approach 2:
The patent divides the circuit into multiple isolated circuit components (resistors, capacitors, diodes, transistors) that can be independently manufactured and then stacked together. Each component is designed with bonding pads for direct connection, eliminating the need for traditional PCB mounting and enabling flexible reconfiguration for different size requirements.
2Reliability
If PCB-based circuit design is used, then circuit stability is improved, but design freedom and space flexibility deteriorate
Solution Approach 1:
By moving from planar 2D PCB design to three-dimensional stacked architecture, the patent provides designers with additional spatial freedom. Circuits can now be arranged vertically with multiple layers stacked on top of each other, dramatically increasing design flexibility while maintaining structural stability through precise bonding pad alignment and standardized connection protocols.
3Ease of manufacture
If isolated circuit components are used with PCB, then ease of manufacture is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent merges multiple isolated circuit components into a compact stacked assembly where components are directly connected through bonding pads without requiring PCB intermediaries. This consolidation reduces the overall device complexity by eliminating redundant connection layers and simplifies the manufacturing process by enabling direct stacking of pre-manufactured components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of flexible, compact, and easily designable circuits that break the 2D limitations of traditional PCB-based designs, enabling wider design space and faster development from concept to implementation.
Implementation Method 1
a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module
Data Source
AI summary
The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.