Vertically Stacked Circuit Package Reduces Display Dead Space
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices with flexible printed circuit boards (FPCBs) face issues with increased dead space and delayed signal transmission due to the need for additional components and bent FPCBs, which complicates the mounting process and leads to signal loss.
Innovation Solution
A display device with a complex circuit package featuring a vertically stacked structure, including a first driving signal structure with a penetration electrode, a redistribution wiring structure, and conductive films that electrically connect the circuit packages, reducing dead space and enhancing signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If FPCB is used to connect driving signal structures, then electrical connection is achieved, but dead space increases due to bending space requirements
Solution Approach 1:
The patent transitions from a planar FPCB connection to a vertical three-dimensional stacking architecture. Multiple driving signal structures are stacked vertically and connected through penetration electrodes that pass through intermediate substrates, eliminating the need for lateral FPCB bending and reducing dead space while maintaining electrical connectivity.
2Adaptability or versatility
If additional driving signal structures are added, then functionality is enhanced, but dead space increases due to additional FPCB requirements
Solution Approach 1:
The patent merges multiple driving signal structures into a single vertical stack, where multiple IC chips are mounted on different layers of the same substrate stack. This consolidation eliminates the need for separate FPCBs for each driving signal structure, reducing dead space while preserving enhanced functionality.
Solution Approach 2:
By arranging driving signal structures in the vertical dimension rather than spreading them horizontally, the patent enables multiple functional units to coexist in a compact footprint, avoiding the dead space associated with multiple lateral FPCB connections.
3Reliability
If signal is transmitted through FPCB, then electrical connection is established, but signal transmission time is delayed
Solution Approach 1:
The patent extracts the signal transmission path from the lengthy lateral FPCB route and replaces it with direct vertical penetration electrodes. This shortens the transmission path and reduces the number of intermediate connection points, thereby decreasing signal transmission time while maintaining reliable electrical connection.
4Adaptability or versatility
If complex circuit structures are implemented, then functionality is improved, but mounting process complexity increases
Solution Approach 1:
The patent segments the complex circuit system into modular layers, each containing specific driving signal structures and connection elements. This modular segmentation allows for standardized manufacturing processes at each layer and simplifies assembly through sequential stacking, reducing overall mounting process complexity despite enhanced functionality.
Data Source
AI summary
A display device includes: a display panel including a display area and a pad area having a pad; and a complex circuit package on the pad, including: a first driving signal structure including a first penetration electrode vertically penetrating an inside of the first driving signal structure; a second driving signal structure on the first driving signal structure; and a redistribution wiring structure surrounding the second driving signal structure, and the redistribution wiring structure electrically connecting the first driving signal structure and the second driving signal structure.