Stacked Circuit Module Layout for Peripheral Heat Suppression
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Solution Overview
Problem
Existing circuit modules fail to effectively suppress heat generated by components between upper and lower circuit boards from being transferred to their periphery.
Innovation Solution
A circuit module design featuring an upper and lower circuit board with a conductor member disposed between them, connected to conductor pins and conductor layers, which efficiently transfers heat generated by a central component to the circuit boards, thereby suppressing its transfer to the component's periphery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a component is disposed between the upper circuit board and the lower circuit board, then electrical connection and circuit functionality are achieved, but heat generated by the component is transferred to the periphery of the component causing overheating issues
Solution Approach 1:
A ground conductor member is introduced as an intermediary between the component and the circuit boards. This ground conductor member serves as a thermal mediator that conducts heat away from the component's periphery to the ground potential, preventing heat accumulation and peripheral overheating while maintaining electrical isolation where needed.
Solution Approach 2:
The patent introduces a vertical dimension for heat dissipation by extending the ground conductor member from the component downward to the lower circuit board. This creates a three-dimensional heat conduction path that removes heat in the vertical direction rather than allowing it to spread horizontally to the periphery.
2Reliability
If conventional substrate structures are used without additional conductor members, then device complexity is low, but heat dissipation capability is insufficient
Solution Approach 1:
The ground conductor member performs multiple functions simultaneously: it provides thermal conduction away from the component, establishes ground electrical potential in the region, and acts as a heat sink interface. This multi-functionality reduces the need for separate dedicated heat dissipation structures.
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the region beneath the component by introducing the ground conductor member with high thermal conductivity. This changes the heat flow distribution parameter, directing heat vertically to the ground rather than horizontally to the periphery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by central components, preventing its spread to the component's periphery by efficiently transferring it to the circuit boards through conductor members and layers, enhancing heat dissipation.
Implementation Method 1
the second conductor member is connected to an upper end of the first conductor member and overlaps at least a part of the first component as viewed in a downward direction... heat generated by a component disposed between the upper circuit board and the lower circuit board from being transferred to the periphery of the component
Data Source
AI summary
An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.