Stacked Circuit Via Structure for Removable Test Pads
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Solution Overview
Problem
Existing methods for forming electrode pads in semiconductor devices result in protrusions that complicate the polishing process and can lead to increased device size and potential quality issues due to residual test components.
Innovation Solution
A fabrication method for stacked devices that includes forming conductive paths and electrode pads, followed by a test step to identify defective components, and then breaking and removing these paths to prevent their inclusion in the final device, while incorporating a heat dissipation structure to manage testing heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode pads are formed with protrusions for bonding wire connection, then the bonding connection is improved, but the polishing process becomes complicated and device size increases
Solution Approach 1:
The patent divides the electrode pad structure into multiple segments: a first electrode pad portion embedded in the insulating film, a second electrode pad portion protruding from the insulating film, and an intermediate connecting portion. This segmentation allows the protruding portion to provide reliable bonding connection while the embedded portion maintains a simple polishing process, resolving the contradiction between bonding reliability and process complexity
Solution Approach 2:
The patent extends the electrode pad structure from a single-plane configuration to a multi-dimensional structure by creating both embedded and protruding portions. The protruding second electrode pad portion extends in the vertical dimension from the insulating film surface, providing bonding wire access without complicating the horizontal polishing process, thus resolving the contradiction between connection reliability and process simplicity
2Ease of manufacture
If test components are left in the device after operation testing, then the testing process is simplified, but unnecessary capacitive components increase device size and reduce quality
Solution Approach 1:
The patent performs operation testing on the semiconductor element before removing the test electrode pad portion. This preliminary testing action ensures that defective elements are identified and removed before final device assembly, while the test components themselves are subsequently removed to maintain device quality, resolving the contradiction between testing ease and manufacturing precision
Solution Approach 2:
The patent uses test electrode pad portions and conductive paths as temporary test components that are deliberately removed after serving their testing purpose. The test components are discarded after enabling quality verification, preventing them from becoming unnecessary capacitive elements in the final device, thus resolving the contradiction between testing simplicity and device precision
3Temperature
If heat dissipation structure is added during testing, then testing heat is managed, but device complexity increases
Solution Approach 1:
The patent forms the heat dissipation structure on the substrate before stacking the semiconductor element and test components. This preliminary formation ensures that testing heat is effectively managed during operation testing, while the heat dissipation structure is integrated into the final device architecture rather than added as a separate temporary component, resolving the contradiction between temperature management and structural simplicity
Solution Approach 2:
The heat dissipation structure serves dual functions: managing testing heat during operation testing and providing thermal management for the final stacked device. This multi-functionality eliminates the need for separate heat management components in the final device, resolving the contradiction between temperature control and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable quality control by identifying and removing test components, preventing unnecessary capacitive components, and minimizing device size by mimicking the final product's electrical connections and heat dissipation, thus enhancing the overall performance and reliability of the stacked devices.
Implementation Method 1
a heat dissipation structure configured to dissipate heat from the circuit portion when the operation test is performed
Data Source
AI summary
Provided is a stacked device comprising: a plurality of circuit layers each having a circuit portion; an insulating layer configured to cover a plurality of circuit portions included in a part of circuit layers of the plurality of circuit layers, and a plurality of conductive vias provided in the insulating layer and electrically connected to the plurality of circuit portions, wherein the conductive via electrically connected to a partial circuit portion of the plurality of circuit portions is electrically insulated on an end surface on an opposite side to the plurality of circuit portions and the partial circuit portion is broken at least partially along a stacking direction.