Stacked Coil Electronic Component with Anisotropic Plating
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Solution Overview
Problem
Existing coil electronic components face challenges in miniaturization and achieving high electrical efficiency due to their thickness and structural limitations, particularly in forming stable inductor structures without substrates and maintaining short insulation distances.
Innovation Solution
A coil electronic component with stacked coil layers featuring anisotropic plating layers, conductive vias, and external electrodes, where the coil patterns have varying widths and are connected through conductive vias, and are covered by insulating layers, including a core part filled with a magnetic material to enhance magnetic characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If coils are embedded in a body formed of an insulating material, then electrical insulation is ensured, but the thickness increases which hinders miniaturization
Solution Approach 1:
The patent transitions from a planar coil structure to a three-dimensional stacked coil layer structure. Multiple coil layers are stacked in the thickness direction with conductive vias connecting corresponding patterns between layers, enabling the coil to achieve its function in a compact vertical arrangement rather than requiring a large planar area with thick insulation layers.
Solution Approach 2:
The patent merges the coil pattern, insulating layer, and conductive via into an integrated stacked structure. The insulating layers are positioned between coil layers and also fill internal spaces within the stacked structure, while conductive vias penetrate through insulating layers to connect coil patterns, creating a compact integrated assembly that eliminates the need for separate thick external insulation bodies.
2Ease of manufacture
If the coil structure is simplified for ease of manufacture, then production efficiency improves, but electrical characteristics and structural stability deteriorate
Solution Approach 1:
The patent divides the coil structure into multiple discrete coil layers, each formed on a separate substrate, with insulating layers and conductive vias connecting them. This segmentation allows each layer to be manufactured and prepared independently using standard PCB fabrication processes, then assembled into the final stacked structure, maintaining manufacturing simplicity while achieving complex three-dimensional electrical characteristics.
Solution Approach 2:
The insulating layers serve multiple functions: they provide electrical insulation between coil layers, structurally support the stacked arrangement, fill internal spaces within the assembly, and provide pathways for conductive vias. This multi-functionality maintains structural stability and electrical performance without requiring additional specialized components or complex manufacturing steps.
3Volume of moving object
If the insulation distance between coil layers is reduced for miniaturization, then thickness decreases, but electrical breakdown risk increases
Solution Approach 1:
The patent uses composite insulating structures consisting of multiple insulating layers with different materials and properties positioned at different locations within the stacked coil structure. These composite insulating arrangements provide enhanced electrical breakdown resistance even at reduced thickness by distributing the electrical stress across multiple material interfaces and pathways.
Solution Approach 2:
The patent applies insulating layers with varying thicknesses and material properties at different locations within the stacked structure. Thicker or more robust insulating materials are positioned in regions with higher electrical stress or where breakdown risk is greater, while thinner insulation is used in lower-stress areas, optimizing the balance between miniaturization and electrical safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables miniaturization and improves electrical characteristics, including direct current (DC) current performance, by forming a stable multilayer structure without a substrate, while maintaining reliable electrical connections and reducing thickness.
Implementation Method 1
coil patterns including anisotropic plating layers
Implementation Method 2
conductive vias connecting the coil patterns formed on different coil layers to each other
Implementation Method 3
a core part filling a hole penetrating through the plurality of coil layers and including a magnetic material
Data Source
AI summary
A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.