Stacked Coil Cooling Structure for Multi-Layer Heat Dissipation
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Solution Overview
Problem
The existing coil devices, such as transformers or reactors, face poor heat dissipation properties due to heat being transferred through sealing materials, leading to inefficient heat dissipation from stacked coils, especially those further away from the dissipation location.
Innovation Solution
A coil device design where coils on upper layers have extending portions that abut a heat dissipation member, allowing heat to be dissipated from all layers without relying on sealing materials, with the extending portions and lower-layer winding portions thermally connected to the cooler via heat dissipation members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing material is used to fill the space between coil unit and coil case to prevent vibration, then anti-vibration performance is improved, but heat dissipation property deteriorates
Solution Approach 1:
The patent removes the sealing material from the heat dissipation path and replaces it with a cooling structure. The space between the coil case and cooling case is designed to allow direct thermal contact, extracting the harmful thermal insulation effect of sealing material and converting it into a beneficial cooling channel.
Solution Approach 2:
The cooling case serves multiple functions: it provides structural support, acts as a heat dissipation path, and eliminates the need for separate sealing materials. The cooling case integrates both mechanical protection and thermal management functions into a single component.
2Quantity of substance
If coils are stacked in multiple layers to increase capacity, then device capacity is improved, but heat dissipation efficiency of upper layer coils deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by stacking cooling plates between coil layers. This vertical arrangement creates multiple heat dissipation paths in the thickness direction, allowing upper layer coils to dissipate heat effectively without increasing horizontal distance to cooling surfaces.
Solution Approach 2:
The cooling structure is divided into multiple cooling plates that are inserted between individual coil layers. Each cooling plate serves as an independent heat dissipation surface for the adjacent coil layers, segmenting the heat dissipation function to ensure efficient thermal management for each layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation from all layers of stacked coils, improving thermal efficiency and reducing device size and manufacturing costs by eliminating the need for sealing materials and coil cases.
Implementation Method 1
heat emitted from the coil body is transferred to the outside of the device after being transferred to the coil case via the sealing material
Implementation Method 2
Heat emitted from a plurality of stacked coils forming a coil body can be dissipated from the coils on all the layers
Data Source
AI summary
Heat emitted from a plurality of stacked coils forming a coil body can be dissipated from the coils on all the layers. A coil device includes a core mounted on a mounting surface of a cooler, a coil body formed by stacking, on the mounting surface, a lower-layer coil and an upper-layer coil having winding portions wound about a winding axis of the core, and heat dissipation members provided on the cooler. The upper-layer coil positioned on a layer other than the lowermost layer has extending portions extending in directions away from the winding axis. The extending portions, and the winding portion of the lower-layer coil positioned on the lowermost layer abut on the heat dissipation members.