Stacked Coil Isolator Layout for Compact Magnetic Insulation
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Solution Overview
Problem
Existing magnetically coupled isolators face challenges in efficiently transmitting signals or energy while maintaining insulation between inductors due to limitations in coupling coefficient and Q-factor, leading to suboptimal manufacturing precision and increased size.
Innovation Solution
The design incorporates a first and second inductor with multiple coil layers positioned in the same plane, separated by an insulating layer, allowing for increased coupling coefficient and Q-factor through optimized coil layer alignment and overlapping configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of turns of the coil is increased to improve coupling coefficient and Q-factor, then signal transmission efficiency is improved, but the device size increases
Solution Approach 1:
The patent transitions from a planar single-layer coil structure to a three-dimensional multi-layer stacked coil structure. The first and second coil layers are positioned at different heights (Z-direction) while maintaining horizontal alignment, effectively utilizing the vertical dimension to increase the number of turns without expanding the device footprint in the X-Y plane.
Solution Approach 2:
The patent implements a nested configuration where the first coil layer and second coil layer are superimposed vertically, with their central axes aligned. The inner ends and outer ends of the coils are positioned to overlap or extend beyond each other, creating a compact nested structure that maximizes the number of turns within a confined spatial envelope.
2Ease of manufacture
If manufacturing precision is relaxed to reduce production difficulty, then manufacturing cost decreases, but coupling coefficient and Q-factor become suboptimal
Solution Approach 1:
The patent divides the coil structure into multiple discrete layers (first coil layer and second coil layer) separated by an insulating layer. This segmentation allows each layer to be manufactured and positioned independently, providing tolerance for manufacturing variations while maintaining the overall coupling performance through the stacked configuration.
Solution Approach 2:
The patent employs parameter optimization in the vertical dimension (spacing between layers, height of coils) to compensate for potential manufacturing tolerances in horizontal positioning. By adjusting the Z-direction parameters, the design maintains optimal coupling coefficient and Q-factor even when precise horizontal alignment is difficult to achieve during manufacturing.
3Volume of moving object
If inductors are placed closer together to reduce device size, then compactness is improved, but insulation between inductors becomes compromised
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the first coil layer and the second coil layer. This insulating layer acts as a mediator that enables close vertical spacing of the coils (reducing device size) while simultaneously providing electrical insulation to prevent short circuits and maintain proper inductor isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal or energy transmission efficiency, suppresses manufacturing fluctuations, and reduces the overall size of the isolator by increasing the number of turns without enlarging the device.
Implementation Method 1
A magnetically coupled isolator utilizes a change of a magnetic field to transmit a signal or energy in a state in which the current is blocked
Data Source
AI summary
An insulating device includes: a first inductor including a first coil layer located in a first plane; a second inductor separated from the first inductor, the second inductor including a second coil layer located in the first plane, a central axis of the second coil layer being positioned inside the first coil layer; and an insulating layer located between the first inductor and the second inductor.