Stacked Coil Component Reducing DC Resistance via Layer Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturized and thinned coil components face challenges in maintaining low direct current (DC) resistance and uniformity due to increased aspect ratios, leading to defects like short-circuits and reduced inductance during manufacturing, especially when using anisotropic plating technology in limited spaces.
Innovation Solution
The solution involves increasing the number of coil turns in stacked layers by forming insulating layers on a support member, ensuring stable stacking and electrical connection between coil layers, which reduces the aspect ratio of conductors and minimizes defects, while maintaining low DC resistance and high inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the aspect ratio of coil conductors is increased to reduce DC resistance in miniaturized components, then low DC resistance is achieved, but the risk of manufacturing defects such as short-circuits increases
Solution Approach 1:
The patent transitions from planar coil patterns to three-dimensional stacked coil layers. By forming multiple coil layers in the vertical stacking direction and electrically connecting them through conductive vias, the invention achieves low DC resistance through increased effective conductor cross-section without requiring high aspect ratio conductors that would be prone to manufacturing defects.
Solution Approach 2:
The coil structure is divided into multiple discrete coil layers separated by insulating layers. Each coil layer can be independently formed and controlled, allowing for better manufacturing precision and reduced defect risk compared to attempting to create a single high aspect ratio conductor. The segmentation also enables electrical connection between layers through vias to achieve low overall DC resistance.
2Loss of energy
If anisotropic plating technology is used to create high aspect ratio coil patterns, then low DC resistance is achieved, but manufacturing precision deteriorates due to non-uniform plating growth
Solution Approach 1:
Instead of relying on vertical plating growth to achieve low DC resistance, the invention uses horizontal stacking of multiple coil layers connected by vias. This approach achieves low DC resistance through increased effective conductor area in the horizontal plane, avoiding the manufacturing precision issues associated with anisotropic plating.
Solution Approach 2:
The coil structure is segmented into multiple layers formed by sequential plating processes. Each layer can be formed with controlled, uniform plating growth, and the overall low DC resistance is achieved through the combined effect of multiple layers rather than relying on high aspect ratio growth in a single layer.
3Volume of moving object
If coil components are miniaturized and thinned to meet electronic device requirements, then device integration is improved, but maintaining low DC resistance and high inductance becomes difficult
Solution Approach 1:
The invention uses vertical stacking of multiple coil layers to increase the effective conductor cross-section and reduce DC resistance without increasing the planar footprint. By utilizing the vertical dimension for layer stacking and connecting layers through conductive vias, low DC resistance is achieved while maintaining miniaturized component dimensions.
Solution Approach 2:
Multiple coil layers are electrically merged through conductive vias to create a unified low-impedance current path. This combining of parallel current paths through stacked layers reduces overall DC resistance while maintaining compact component size, as the effective conductor area is increased without expanding the component footprint.
4Loss of energy
If the number of coil turns is increased to maintain inductance in miniaturized components, then inductance is preserved, but the component thickness increases
Solution Approach 1:
The patent uses vertical stacking of multiple coil layers to increase the number of effective turns while controlling thickness. By forming insulating layers between coil layers and using controlled via connections, the invention achieves high inductance through increased turn count without excessive thickness increase, as the stacking efficiency is optimized.
Solution Approach 2:
The coil structure is segmented into multiple layers with insulating layers between them. This segmentation allows for efficient vertical stacking that increases the number of turns per unit thickness, as each layer can be optimally designed and the insulating layers provide electrical isolation while minimizing thickness overhead.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively decreases the risk of defects, secures uniformity, and achieves low DC resistance and high inductance, enhancing the performance and reliability of miniaturized coil components.
Implementation Method 1
a coil part disposed in the body part
Implementation Method 2
forming a first coil layer on at least one surface of a support member by plating
Data Source
AI summary
A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.