Stacked Cold Plate Vanes for Higher Heat Transfer in Compact Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing cooling systems for electrical components in propulsion systems, such as gas turbine engines and electric engines, are inefficient in effectively removing heat, leading to potential damage and performance issues.

Innovation Solution

A cold plate assembly comprising a manifold, comb insert, and vanes with throughholes that guide cooling fluid at increased velocity to enhance heat transfer, utilizing a zigzag pattern to increase convective heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional cooling plates are used to cool electrical components, then the system structure is simple, but the heat transfer efficiency is insufficient

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidcooling system structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cooling plate is segmented into multiple functional layers: a manifold layer with cooling passages, a comb insert with channels, and multiple vanes with through-holes. This segmentation allows each layer to perform a specific function (fluid distribution, heat transfer, flow guidance) thereby significantly improving heat transfer efficiency while maintaining reasonable structural complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional two-dimensional cooling channels to a three-dimensional multi-layer structure with vanes extending between comb walls. The fluid flow is directed through multiple dimensions via through-holes in vanes, creating complex flow patterns that enhance convective heat transfer while utilizing the third dimension vertically within the cooling plate assembly

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If cooling system size is reduced, then weight decreases, but heat transfer performance may be compromised

Engineering Contradiction:
Improveheat transfer performanceVSAvoidcooling system weight
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The cooling system employs a nested structure where vanes are positioned within channels defined by comb walls, and the comb insert is nested within the manifold cavity. This nesting allows maximum heat transfer surface area to be packed into a compact volume, achieving high heat transfer performance in a reduced-size, lightweight assembly

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The vanes incorporate through-holes that create a porous-like flow path structure. This allows fluid to pass through the vanes and impinge on multiple surfaces, dramatically increasing the effective heat transfer area within a compact volume without adding significant weight, thereby achieving high heat transfer performance in a lightweight design

Inventive Principle:
Principle #31Porous materials

3Reliability

If fluid velocity is increased to enhance heat transfer, then convective cooling improves, but fluid pressure requirements increase

Engineering Contradiction:
Improveconvective heat transferVSAvoidfluid pressure
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The vanes are positioned at angled orientations (e.g., 45 degrees) relative to the fluid flow direction, creating curved flow paths as fluid passes through the channels. This curvature generates centrifugal forces and secondary flows that enhance convective heat transfer coefficients, allowing effective cooling at moderate fluid velocities and pressure requirements

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cold plate assembly achieves higher convective heat transfer performance with reduced size and weight, effectively cooling electrical components in propulsion systems.

Implementation Method 1

a cold plate assembly for cooling an electronic device... receiving heat from the electronic device and transferring the heat to the cooling fluid

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

transfer heat to the fluid... increase the heat transfer between the fluid and the first wall or the second wall

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS12581618B2Stacked cold plate with flow guiding vanes having through holes and method of manufacturing
Publication Date: 2026.03.17 ROLLS ROYCE CORP
  • US12581618B2 patent drawing
  • US12581618B2 patent drawing
  • US12581618B2 patent drawing

AI summary

A cold plate assembly for cooling an electronic device includes a manifold, a comb insert, and a plurality of vanes. The manifold is formed to define a cavity therein. The comb insert is located in the cavity and formed to include channels for receiving a fluid from cooling passages in the manifold and transfer heat to the fluid. The plurality of vanes are removably coupled with the comb insert and are located in the channels to guide the fluid through channels. The vanes extend between walls that define the channels. Each vane is formed to define a throughhole formed therein to direct the fluid at the first wall or the second wall with increased velocity so as to increase the heat transfer between the fluid and the first wall or the second wall.