Stacked Compound Lens Module for High-Resolution CMOS Integration
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Solution Overview
Problem
Conventional wafer-level packaged image capture lens modules face challenges such as exacerbated optical performance limitations, substrate and lens replication issues, and alignment inaccuracies, which hinder integration with high-resolution CMOS image sensor chips like 2M or 3M CMOS image sensor chips.
Innovation Solution
The proposed solution involves a stacked compound lens configuration with specific curvature radii and Abbe numbers for lens elements, along with a spacer and cover glass, optimized for improved modulation distribution and higher MTF values, integrated with a CMOS image sensor chip and supporting decoders and converters for enhanced image capture performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional wafer-level packaging technology is used for image capture lens modules, then manufacturing cost is reduced and production volume is increased, but optical performance is exacerbated and alignment accuracy deteriorates
Solution Approach 1:
The lens module is divided into multiple compound lenses (first compound lens with three elements, second compound lens with three elements) with distinct functions. Each compound lens addresses specific optical requirements, allowing optimized performance while maintaining manufacturability through modular design
Solution Approach 2:
Different lens elements have specifically tailored properties: the first lens element has high Abbe number (>55) for chromatic aberration correction, while the third lens element has low Abbe number (<30) for other aberration corrections. This local optimization of material properties throughout the lens system achieves superior overall optical performance
2Volume of moving object
If conventional wafer-level packaged lens module configuration is used, then device size is reduced, but integration capability with high-resolution CMOS image sensor chips deteriorates
Solution Approach 1:
The patent transitions from a two-piece lens module configuration to a six-element stacked compound lens configuration, adding dimensional complexity in the optical path. This multi-layered approach enables better adaptation to high-resolution CMOS image sensor chips while maintaining compact form factor suitable for portable devices
3Device complexity
If simple lens configuration is used, then manufacturing complexity is reduced, but modulation distribution and MTF values deteriorate
Solution Approach 1:
The optical system is segmented into six distinct lens elements arranged in two compound lenses, with each element contributing to specific optical functions. This segmentation enables precise control over light paths and improves modulation transfer function values while maintaining manageable manufacturing complexity through systematic design
Solution Approach 2:
The patent employs composite lens design combining multiple materials with different optical properties (high Abbe number and low Abbe number materials) in a structured configuration. This composite approach optimizes modulation distribution and MTF values by leveraging the complementary strengths of different materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves modulation distribution and MTF values at 70 lp/mm and 140 lp/mm, enabling higher image quality and better integration with high-resolution CMOS image sensor chips, while reducing the lens module's height for portable applications.
Implementation Method 1
a curvature radius of the first lens element is positive, a curvature radius of the third lens element is negative, a curvature radius of the fourth lens element is negative, and an abbe number of the first lens element exceeds 55 and an abbe number of the third lens element is less than 30
Data Source
AI summary
Image capture lens modules and image capture systems are presented. An image capture lens module includes a first compound lens with a first lens element, a second lens element, and a third lens element arranged in sequence from an object side to an image side. A second compound lens includes a fourth lens element, a fourth lens element, and a fifth lens element arranged in sequence from an object side to an image side. A curvature radius of the first lens element is positive, a curvature radius of the third lens element is negative, a curvature radius of the fourth lens element is negative, and a curvature radius of the sixth lens element is negative. An abbe number of the first lens element exceeds 55 and an abbe number of the third lens element is less than 30.