Stacked Connector Assembly for PCB Space and Module Expansion

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Solution Overview

Problem

The spatial limitations on printed circuit boards due to the mounting of multiple connectors hinder the structural improvement and functionality of electronic devices, as they occupy valuable space and restrict the placement of additional components.

Innovation Solution

Implementing a vertical stack structure for connectors on the printed circuit board, allowing multiple connectors to be mounted in a Z-axis configuration, thereby creating available space on the board for other components and enhancing the overall design efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple connectors are mounted on the printed circuit board to support connection with electronic parts, then the electrical connection capability is improved, but the available space on the printed circuit board is reduced

Engineering Contradiction:
Improveelectrical connection capabilityVSAvoidavailable space on printed circuit board
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement of connectors on the printed circuit board to a three-dimensional stacked configuration. Multiple connectors are arranged vertically along the Z-axis, allowing them to occupy different height levels while projecting to the same or overlapping footprints on the board plane. This dimensional transition enables multiple connectors to coexist without significantly increasing the board area occupation, thereby resolving the contradiction between connection capability and available space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested arrangement where connectors are stacked one above another in the vertical direction, with each connector positioned within the vertical projection of the ones above or below it. This nesting approach allows multiple connectors to be packed into a compact vertical space, maximizing the use of the Z-axis dimension while minimizing the horizontal space consumption on the printed circuit board.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple connectors are mounted on the printed circuit board, then the functionality of electronic parts is improved, but the structural improvement of electronic device is hindered

Engineering Contradiction:
Improvefunctionality of electronic partsVSAvoidstructural improvement
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

By moving from planar to spatial arrangement, the patent enables multiple connectors to be integrated without increasing the complexity of the board layout. The vertical stacking provides a clear and organized structure that is easier to manage than dense planar arrangements, particularly for signal routing and mechanical support.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the connector assembly into separate modular units that are stacked vertically. Each connector can be independently designed, manufactured, and replaced, which simplifies the overall structure and improves maintainability. This segmentation approach makes the system more manageable despite having multiple connectors.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3726821B1Electronic apparatus comprising connector of stacked structure
Publication Date: 2024.12.18 SAMSUNG ELECTRONICS CO LTD
  • EP3726821B1 patent drawingFigure 1
  • EP3726821B1 patent drawingFigure 2
  • EP3726821B1 patent drawingFigure 3

AI summary

Disclosed is an electronic device that includes a first printed circuit board including at least one electronic part, a first header mounted on the first printed circuit board, a first module that includes, on a first surface thereof, a first socket for engagement with the first header and includes a second header on a second surface opposite to the first surface and that performs a first function, a second module that includes, on one surface thereof, a second socket for engagement with the second header and that performs a second function, and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header. Besides, it may be permissible to prepare various other embodiments speculated through the specification.