Stacked Connector Wafer Inserts for Differential Signal Crosstalk Reduction
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Solution Overview
Problem
Designing and manufacturing reliable high-speed connectors for printed circuit boards is challenging due to increased crosstalk between closely spaced signal paths, which is exacerbated by the need for differential signal pairs and minimal connector width requirements.
Innovation Solution
A stacked receptacle connector with insulative housing accommodating differential signal pairs using thin wafer inserts, where signal terminals are oriented for broadside capacitive coupling and ground terminals provide shielding, reducing crosstalk and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If differential signal pairs are arranged alongside each other on the same side of a circuit board to maintain capacitive coupling, then signal transmission quality is improved, but connector width increases
Solution Approach 1:
The patent transitions the arrangement of differential signal pairs from a two-dimensional planar layout (side-by-side on the same board layer) to a three-dimensional stacked configuration across multiple board layers. This dimensional change allows capacitive coupling to be maintained through vertical stacking while reducing the horizontal footprint and connector width.
Solution Approach 2:
The patent implements nested stacking where differential signal pairs are arranged in alternating orientations across multiple layers, with each layer's signal pairs positioned within the bounding box of the layers below and above. This nesting approach maximizes space utilization and maintains capacitive coupling while minimizing overall connector width.
2Object-affected harmful factors
If ground planes are provided between conductors of different differential pairs to reduce crosstalk, then electromagnetic interference is reduced, but connector complexity increases
Solution Approach 1:
The patent combines the ground plane function with the structural support function by integrating ground terminals into the same wafer inserts that provide mechanical support for signal terminals. This merging eliminates the need for separate ground plane structures and reduces overall connector complexity while maintaining EMI shielding.
Solution Approach 2:
The wafer inserts are designed to serve multiple functions simultaneously: providing mechanical support for terminals, establishing electrical connections, and creating ground planes for EMI shielding. This multi-functionality reduces the number of separate components needed and simplifies the overall connector structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes connector width while maintaining capacitive coupling and reducing electromagnetic interference (EMI) and signal cross-talk, enhancing high-speed transmission capabilities.
Implementation Method 1
the terminals having contact portions, tail portions and body portions interconnecting the contact and tail portions together, the signal terminals being disposed so that most of the terminals are oriented with their wider sides arranged vertically for broadside capacitive coupling to adjacent corresponding terminals in adjacent wafers
Implementation Method 2
A stacked receptacle connector that enables differential signal pairs to be installed into a connector body using individual inserts in the form of wafers, each of which is relatively easy to manufacture and each of which also allows ground planes to be provided between each wafer insert in an encompassing connector housing
Data Source
AI summary
Stacked receptacles in a connector that each provide side-by-side differential signal contacts, are attached to a circuit board without additional width to accommodate multiple layers of differential signals by using connector wafer inserts that rotate the side-by-side positioned differential signal contacts to front-to-back contacts, the circuit board including a substrate having a plurality of openings to make electrical contact with conductive terminal tail portion inserted therein, the openings being divided into first and second groups of openings, the first group of openings receiving differential signal terminal tails therein and the second group of openings receiving ground terminal tail therein, when a connector is mounted to said circuit board.