Stacked Contact Wafer Shielding for Crosstalk Reduction
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Solution Overview
Problem
Existing high-speed high-density connector assemblies face challenges in achieving effective shielding due to limitations in materials and plating techniques, leading to inadequate thermal and mechanical properties, as well as increased crosstalk between signal conductors.
Innovation Solution
The solution involves a stacked contact wafer assembly with conductive bodies and shielding members, where each contact module includes an insulator and a pair of contacts shielded by the conductive body and shielding members, providing improved shielding performance by using thermoplastic with metal plating and strategically designed slots to reduce crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If plastics are coated with metals to provide shields, then shielding performance is improved, but thermal and mechanical properties deteriorate due to lack of desired properties in available plastic-metal combinations
Solution Approach 1:
The patent employs composite materials by combining thermoplastic with metal plating to create a hybrid shielding structure. The thermoplastic provides mechanical support and structural integrity, while the metal plating delivers effective electromagnetic shielding. This composite approach resolves the contradiction by leveraging the strengths of both materials without compromising either shielding performance or mechanical properties.
2Object-affected harmful factors
If available plating techniques are used, then shielding is provided, but selectivity deteriorates as plating techniques are not selective
Solution Approach 1:
The patent applies local quality by implementing selective metal plating only on specific regions where shielding is required, rather than uniformly plating entire components. The plating is strategically applied to contact surfaces and shielding-critical areas, optimizing both shielding effectiveness and manufacturing efficiency while maintaining selectivity in the plating process.
3Productivity
If stacked contact wafers are used to increase density, then connection density is improved, but crosstalk between signal conductors increases
Solution Approach 1:
The patent introduces an intermediary shielding structure consisting of metal-plated thermoplastic barriers positioned between adjacent contact wafers and signal conductors. This intermediary shielding layer acts as a mediator that blocks electromagnetic interference and crosstalk between closely spaced conductors, enabling high-density stacking while maintaining signal integrity.
4Object-affected harmful factors
If metal plating is applied to thermoplastic, then shielding performance is improved, but plating integrity deteriorates due to challenges in maintaining plating quality
Solution Approach 1:
The patent addresses plating integrity by optimizing parameters such as surface preparation treatments, plating thickness control, and adhesion promotion techniques. By carefully controlling these parameters, the patent achieves durable metal plating on thermoplastic surfaces that maintains both shielding performance and structural integrity throughout the product lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances shielding performance, reduces crosstalk, and maintains the integrity of metal plating, ensuring reliable signal transmission and improved mechanical properties.
Implementation Method 1
Each contact module includes an insulator and a pair of contacts shielded by the conductive body and the one or more shielding members
Implementation Method 2
thermoplastic with metal plating
Data Source
AI summary
An electrical connector (50; 70; 80; 90; 91) includes a number of contact wafers (502; 61; 71; 822; 920) stacked with each other along a transverse direction. Each contact wafer includes a conductive body, one or more shielding members (53; 68; 720; 900) mounted to and electrically connecting with the conductive body, and a number of contact modules each including an insulator (550; 621) and a pair of contacts (551; 620; 921) fixed by the insulator, the pair of contacts of each contact module being shielded by the conductive body and the one or more shielding members.