Stacked Converter Module With 3D Cooling for High-Voltage PCBs
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Solution Overview
Problem
Conventional power conversion systems using planar magnetic topologies require thick printed circuit boards with numerous layers to handle high voltages, leading to excessive heat generation, mechanical stress, and increased costs due to the need for additional cooling components.
Innovation Solution
A stacked magnetic converter assembly comprising multiple converter modules with an input-series-output-parallel (ISOP) topology, utilizing a metal core board and three-dimensional cooling paths, along with interleaved shielding layers to reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If planar magnetic topologies are used with thick PCBs to handle high voltages, then power conversion capability is improved, but heat dissipation becomes insufficient and reliability deteriorates
Solution Approach 1:
The patent transitions from conventional two-dimensional planar magnetic topologies to a three-dimensional stacked modular architecture. Multiple converter modules are vertically stacked with magnetic units positioned between PCB layers, enabling high-voltage power conversion while providing adequate thermal pathways in the vertical dimension. This dimensional transition resolves the contradiction by maintaining reliability through improved heat dissipation while achieving the required power conversion capability.
2Power
If conventional planar magnetic converters are designed to dissipate over 100W of power, then power conversion is achieved, but excessive heat is generated requiring additional cooling components that increase weight and cost
Solution Approach 1:
The patent merges the magnetic units directly with the PCB structure in a stacked modular configuration, where magnetic units are positioned between PCB layers and integrated with the converter modules. This integration eliminates the need for separate external cooling components by utilizing the PCB and magnetic unit assembly itself as the heat dissipation structure, thereby achieving 100W+ power dissipation without increasing weight through additional cooling hardware.
3Stress or pressure
If thick PCBs with excessive number of layers are used to sustain high-voltages, then voltage handling is improved, but electro-mechanical stress increases leading to reduced reliability
Solution Approach 1:
The patent segments the PCB into multiple thin PCB layers stacked vertically, with magnetic units positioned between the layers. This segmentation replaces a single thick PCB with excessive layers with multiple thinner PCB layers, reducing electro-mechanical stress on each individual layer while maintaining the ability to sustain high voltages through the stacked configuration. The segmentation principle resolves the contradiction by distributing voltage handling across multiple layers rather than concentrating stress in a single thick PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools the converter assembly through multi-dimensional heat dissipation, reduces electromagnetic interference, and minimizes the need for large heat sinks, thereby decreasing package size and overall costs.
Implementation Method 1
utilizing a metal core board and three-dimensional cooling paths
Implementation Method 2
interleaved shielding layers to reduce electromagnetic interference
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A converter module (102) comprising a metal core board (202) including a metal base layer (206) an insulating layer (204) that supports a primary switching unit and a secondary switching unit; and a printed circuit board (200) that supports a converter unit in electrical isolation from the metal core board; the printed circuit board (200) and the metal core board (202) each contain a through-hole (210, 208).