Stacked Power Converter Cooling Layout for Shorter Heat Paths
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Solution Overview
Problem
The existing power conversion devices face challenges in heat dissipation due to increased heat generation from high-heat generating components, leading to larger device sizes and degraded heat dissipation efficiency, particularly in automobile motor drive devices where the heat dissipation path becomes lengthy and inefficient.
Innovation Solution
The power conversion device incorporates multiple substrates and cooling bodies to distribute heat-generating components, shortening heat dissipation paths and preventing the expansion of the cooling system, thereby maintaining a compact size and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of high-heat generating components is increased to meet higher output demands, then the power conversion device can provide higher output, but the bottom area of the device must be increased to accommodate these components, resulting in device size increase
Solution Approach 1:
The patent transitions from a two-dimensional layout (components arranged on the bottom surface) to a three-dimensional stacked configuration. Multiple substrates are stacked vertically with cooling bodies interspersed between them, allowing high-heat generating components to be arranged in multiple layers rather than confined to a single plane. This vertical stacking enables higher component density without increasing the device footprint.
Solution Approach 2:
The patent implements a nested structure where cooling bodies are integrated between substrates in a layered configuration. The cooling bodies are positioned within the stacked arrangement of substrates, creating a compact nested structure where thermal management components are embedded within the functional layers rather than being separate additions.
2Loss of energy
If heat dissipation paths are lengthened to accommodate more components, then more heat can be dissipated, but the heat dissipation efficiency is degraded due to longer thermal paths
Solution Approach 1:
The patent shortens heat dissipation paths by transitioning from horizontal heat transfer across the bottom surface to vertical heat transfer through the stacked layers. The cooling bodies are positioned adjacent to heat-generating components in the vertical dimension, creating direct thermal coupling and minimizing the length of heat dissipation paths while maintaining effective heat removal capacity.
Solution Approach 2:
The patent implements localized heat dissipation by positioning cooling bodies in direct thermal contact with specific heat-generating components on each substrate. Each cooling body is strategically placed to address the thermal management needs of adjacent high-heat generating components, creating localized efficient heat transfer zones rather than relying on long-distance thermal conduction.
3Loss of energy
If the cooling system is expanded to handle increased heat generation from more components, then heat dissipation capacity is improved, but the device size increases
Solution Approach 1:
The patent merges the cooling system with the structural framework of the device by integrating cooling bodies directly into the stacked substrate arrangement. The cooling bodies become an intrinsic part of the layered structure rather than separate external components, eliminating the need for additional space and achieving thermal management within the existing device volume.
Solution Approach 2:
The cooling bodies are nested within the stacked configuration of substrates, with each cooling body positioned in the interlayer spaces. This nested arrangement allows the cooling system to occupy spaces that would otherwise be empty, achieving comprehensive thermal management without increasing the overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the increase in device size and improves heat dissipation by distributing heat-generating components across multiple substrates, ensuring efficient thermal management and high output performance.
Implementation Method 1
The heat generated in the electronic components is transferred to a cooling body through a heat dissipation path, and is dissipated from the cooling body. In this way, temperatures of the electronic components are suppressed
Data Source
AI summary
A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.