Stacked Power Converter Package for Isolation and Heat Dissipation
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Solution Overview
Problem
Power converters face challenges in system-level packaging due to high-voltage interference and heat dissipation issues, leading to potential damage to control circuits and inefficient thermal stability.
Innovation Solution
A package structure for power converters is designed with a power device die featuring a support area on one surface and pad areas on opposite surfaces, allowing the power device die to double as a support component for the control circuit die, reducing chip area and improving heat dissipation and voltage resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a tiled layout of control circuit and power devices is used, then high-voltage isolation is achieved, but chip area becomes excessive
Solution Approach 1:
The patent transitions from a planar tiled layout to a three-dimensional stacked architecture, placing the control circuit die on top of the power device die. This vertical stacking enables high-voltage isolation between layers while significantly reducing the horizontal chip area occupied by the same components.
Solution Approach 2:
The patent combines multiple functions into the power device die by integrating a support area that serves both as a structural foundation for mounting the control circuit and as a heat dissipation pathway. This merging eliminates the need for separate support components and reduces overall chip area.
2Strength
If a separate silicon plate support component is used, then structural support is provided, but heat accumulation occurs in the power device
Solution Approach 1:
The patent merges the support function with the heat dissipation function by designing the power device die to include an integrated support area. This area provides structural support for mounting the control circuit while simultaneously serving as a thermal pathway to conduct heat away from the power device, eliminating the need for a separate silicon plate that would trap heat.
Solution Approach 2:
The support area on the power device die performs multiple functions: it provides mechanical support for the control circuit die, establishes electrical connections through pads, and facilitates heat dissipation from the power device. This multi-functionality eliminates the need for separate dedicated support components.
3Strength
If a separate silicon plate with patterning process is used, then support structure is formed, but manufacturing cost increases
Solution Approach 1:
The patent combines the support structure with the power device die itself, eliminating the need for a separate silicon plate and its associated patterning process. The support area is formed as an integral part of the power device die using the same semiconductor fabrication processes, thereby reducing manufacturing steps and costs.
Solution Approach 2:
The power device die serves dual purposes: as the active power switching component and as the structural support platform for the control circuit. This eliminates the need for separate support components and their manufacturing processes, reducing overall manufacturing complexity and cost.
Data Source
AI summary
The present disclosure provides a package structure and a package method for a power converter. The package structure includes at least one power device die and a control circuit die. The at least one power device die includes a first pad area and a support area on a first surface, and a second pad area on a second surface, wherein the first surface and the second surface are opposite each other. The control circuit die is on the support area of the at least one power device die. The package structure uses at least one power device die on the first surface to provide the support area to form a stacked structure, so as to reduce a chip area of the package structure and improve voltage resistance and heat dissipation performance of the chip.