Stacked Cooling Plates for Compact Double-Sided Electronics Cooling
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Solution Overview
Problem
Existing electronic component cooling structures and vehicle driving devices face challenges in efficiently cooling multiple electronic components while maintaining a compact device size, as they often rely on single-sided cooling which limits cooling efficiency and requires increased device size with more components.
Innovation Solution
The proposed solution involves a stacked configuration of multiple cooling plates with integrated cooling fluid flow paths, allowing cooling fluid to flow through each plate and cool electronic components placed on both sides of the plates, thereby doubling the cooling area and enhancing cooling efficiency in a space-saving manner.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling plate is used to cool electronic components, then the device structure is simple, but the cooling area is limited and cannot efficiently cool multiple components
Solution Approach 1:
The cooling system is divided into multiple cooling plates instead of using a single cooling plate. Each cooling plate can independently cool electronic components on its cooling surface, thereby increasing the total cooling area and improving cooling efficiency while maintaining relatively simple individual plate structures
Solution Approach 2:
The cooling plates are arranged in a stacked configuration along the vertical direction, transitioning from a single-plane cooling approach to a multi-layer three-dimensional cooling structure. This dimensional change allows electronic components to be cooled from multiple levels simultaneously, significantly increasing the cooling area without proportionally increasing the horizontal footprint
2Temperature
If the area of cooling plates is increased to cool more electronic components, then the cooling area is improved, but the device size increases
Solution Approach 1:
Multiple cooling plates are stacked vertically to increase the total cooling area while maintaining a compact horizontal footprint. The cooling area is expanded in the vertical dimension rather than the horizontal dimension, allowing more electronic components to be cooled without significantly increasing the device's planar size
Solution Approach 2:
The cooling plates are nested in a stacked configuration where each plate is positioned above or below another, creating a compact vertical arrangement. This nesting approach allows multiple cooling surfaces to be contained within a small horizontal space, effectively increasing cooling area without proportionally increasing device footprint
3Temperature
If electronic components are disposed on both sides of cooling plates, then the cooling efficiency is enhanced, but the device structure becomes more complex
Solution Approach 1:
Electronic components are arranged on both the upper and lower surfaces of each cooling plate, utilizing the vertical stacking dimension to double the component cooling capacity per plate. This bidirectional arrangement increases cooling efficiency without requiring additional horizontal space, and the modular plate structure keeps individual component placements relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the cooling efficiency of electronic components by doubling the cooling area compared to single-sided cooling, while also allowing for a more compact device design by optimizing the arrangement of cooling plates and electronic components.
Implementation Method 1
electronic components are cooled via the facing cooling plates
Implementation Method 2
cooling fluid for cooling an electronic components flowing through the cooling fluid flow path
Data Source
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AI summary
In an electronic component cooling structure in which a plurality of cooling plates (11, 12) each having a cooling fluid flow path (R) therein is disposed, cooling fluid for cooling an electronic components (15, 16, 21, 22, 66, T) flowing through the cooling fluid flow path (R), the electronic components (15, 16, 21, 22, 66, T) are disposed at both sides of each of the number of plurality plates (11, 12), the electronic components (15, 16, 21, 22, 66, T) facing the cooling plates (11, 12), and the electronic components (15, 16, 21, 22, 66, T) are cooled via the facing cooling plates (11, 12).