Current-Mode Stacked Transconducting Amplifier for High-Voltage RF Power

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Solution Overview

Problem

Conventional high-voltage signal amplifiers face limitations in output power and efficiency due to device stacking approaches, which result in reliability concerns and large layout sizes, especially when using voltage mode combining techniques.

Innovation Solution

The design employs stacked transconducting cells in current mode combining, where transconducting cells are connected in cascode for DC supply current and in cascade or parallel for RF input and output signals, utilizing single-input single-output matching networks to reduce gate/base resistive losses and simplify the layout.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If conventional voltage mode combining techniques are used with stacked devices, then output power can be increased, but layout size becomes large and reliability concerns arise

Engineering Contradiction:
Improveoutput powerVSAvoidlayout size
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent merges multiple transconducting cells into a stacked configuration where they share a common DC supply current path. The cells are combined such that their AC RF output currents are summed at a common output node, eliminating the need for separate combining networks for each cell and reducing overall layout size while maintaining high output power capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The amplifier is segmented into multiple transconducting cells that are stacked in series for DC current sharing. Each cell processes a portion of the total output power requirement, and the segmented cells are connected such that their outputs are combined at a common node, achieving power scaling without proportional increase in layout area

Inventive Principle:
Principle #1Segmentation

2Power

If conventional voltage mode combining techniques are used with stacked devices, then output power can be increased, but reliability concerns arise

Engineering Contradiction:
Improveoutput powerVSAvoidreliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent merges multiple transconducting cells into a stacked configuration where they share a common DC supply current path. The cells are combined such that their AC RF output currents are summed at a common output node, eliminating the need for separate combining networks for each cell and reducing overall layout size while maintaining high output power capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a common output node as an intermediary that collects AC RF output currents from all stacked transconducting cells. This intermediary node serves as a reliable aggregation point that simplifies the combining process and reduces the complexity and potential failure points associated with conventional voltage mode combining techniques

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If device stacking is used to increase output power, then higher power is achieved, but gate/base resistive losses increase

Engineering Contradiction:
Improveoutput powerVSAvoidgate/base resistive losses
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent replaces the conventional voltage mode combining mechanism with a current mode combining approach. Instead of combining voltages through resistive networks that incur gate/base losses, the invention combines AC RF output currents directly at a common node, substituting the voltage combining mechanism with a current summing mechanism that avoids the associated resistive losses

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Power

If conventional stacked device approaches are used, then higher output power is achieved, but layout size increases

Engineering Contradiction:
Improveoutput powerVSAvoidlayout size
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent merges multiple transconducting cells into a stacked configuration where they share a common DC supply current path. The cells are combined such that their AC RF output currents are summed at a common output node, eliminating the need for separate combining networks for each cell and reducing overall layout size while maintaining high output power capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common output node serves multiple functions: it acts as the DC current return path for all stacked cells, the AC RF output current summing point, and the single connection point to the output matching network. This multi-functionality reduces the number of separate components and connections needed, simplifying the overall layout

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12113486B2Amplifier with stacked transconducting cells in parallel and/or cascade “current mode” combining
Publication Date: 2024.10.08 THE BOEING CO
  • US12113486B2 patent drawing
  • US12113486B2 patent drawing
  • US12113486B2 patent drawing

AI summary

An amplifier with stacked transconducting cells in parallel and/or cascade “current mode” combining is disclosed herein. In one or more embodiments, a method for operation of a high-voltage signal amplifier comprises inputting, into each transconducting cell of a plurality of transconducting cells, a direct current (DC) supply current (Idc), an alternating current (AC) radio frequency (RF) input current (IRF_IN), and an RF input signal (RFIN). The method further comprises outputting, by each of the transconducting cells of the plurality of transconducting cells, the DC supply current (Idc) and an AC RF output current (IRF_OUT). In one or more embodiments, the transconducting cells are connected together in cascode for the DC supply current (Idc), are connected together in parallel (or in cascade) for the RF input signal (RFIN), and are connected together in parallel (or in cascade) for the AC RF output currents (IRF_OUT).