Stacked IC Dice Direct Electrical Connection
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Solution Overview
Problem
There is a need to increase die density within a single integrated circuit package while maintaining existing package dimensions and footprint, which existing technologies fail to achieve effectively.
Innovation Solution
The solution involves stacking multiple dice or chips on top of each other within a single package, with each die having specific functionalities such as microcontrollers or memory, and using conductive elements for direct electrical connections between them, allowing for better electrical performance and signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If multiple dice are stacked within a single package to increase die density, then the die area within package is improved, but the package dimensions and footprint must be maintained
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of dice to a three-dimensional stacked arrangement. Multiple dice are positioned at different vertical levels (z-axis) within the package, allowing increased die area without expanding the package footprint. The support structure includes vertical walls that define the stacking geometry, enabling efficient use of vertical space while maintaining a compact footprint.
2Reliability
If conventional packaging methods are used, then package simplicity is maintained, but die density and electrical performance are insufficient
Solution Approach 1:
The patent introduces a support structure as an intermediary element between the stacked dice. This support structure includes vertical walls and horizontal surfaces that mechanically support the dice at different levels and provide pathways for electrical interconnections. The intermediary structure enables both mechanical stability and electrical connectivity while maintaining a compact configuration, resolving the trade-off between reliability and complexity.
Solution Approach 2:
The patent implements a nested arrangement where multiple dice are positioned within a hierarchical structure defined by vertical walls and support surfaces. Smaller dice are nested within the three-dimensional space created by the support structure, with each die supported by horizontal surfaces and confined by vertical walls. This nesting approach maximizes die density while maintaining structural integrity and electrical connectivity.
3Reliability
If more wire connections are used for interconnections, then electrical connectivity is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent merges multiple functions into the support structure: mechanical support, electrical interconnection pathways, and spatial organization. The vertical walls and horizontal surfaces of the support structure serve both to hold the dice in position and to provide integrated electrical connections between stacked dice. This consolidation reduces the number of separate wire connections needed and simplifies the manufacturing process while maintaining reliable electrical connectivity.
Data Source
AI summary
An arrangement of integrated circuit dice, includes first die including a first electrical coupling site and a second die comprising a second electrical coupling site, wherein the second die is stacked onto the first die such that the first electrical coupling site is at least partially exposed, wherein the first electrical coupling site and the second electrical coupling site are directly electrically connected, and a third die arranged above the first die and the second die such that a recess is formed, wherein one of the first electrical coupling sites is arranged in the recess.