Stacked Die Backside Power Delivery for Shorter Interconnect Paths
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Solution Overview
Problem
Integrating electronic components of different powers poses challenges in reducing distance and increasing the number of input/output terminals, which affects performance.
Innovation Solution
The electronic device includes a first die and a second die, where the second die is disposed over the first die, and power is transmitted through the backside surfaces of both dies, allowing different powers to be provided to each die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If different electronic components are integrated with traditional wiring, then the distance between components increases, but performance deteriorates due to longer transmission paths
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional vertical wiring through the substrate. Power and signal terminals are arranged in multiple layers above and below the substrate, enabling short-distance transmission in the vertical dimension while maintaining component integration.
2Quantity of substance
If traditional single-sided wiring is used, then the number of I/O terminals is limited, but integration capability deteriorates
Solution Approach 1:
The patent utilizes both upper and lower surfaces of the substrate for terminal arrangement, transitioning from single-sided to multi-sided wiring. This spatial expansion in multiple dimensions significantly increases the number of available I/O terminals while enhancing integration capability.
Solution Approach 2:
The patent implements multi-layered wiring structures where conductive paths are nested in different layers above and below the substrate. This nested arrangement allows multiple I/O terminals to be packed in a compact space, increasing terminal quantity without proportionally increasing device footprint.
3Device complexity
If components with different power requirements are integrated using conventional methods, then device complexity increases, but manufacturing difficulty worsens
Solution Approach 1:
The patent segments the wiring structure into distinct upper and lower wiring layers, each handling specific power and signal connections. This segmentation allows independent optimization and manufacturing of each layer, reducing overall manufacturing difficulty despite the complex integration of components with different power requirements.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first die and a second die. The second die is disposed over the first die. A backside surface of the second die faces a backside surface of the first die. An active surface of the second die is configured to receive a first power. The second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.