Stacked Semiconductor Die Configuration for Circuit Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity and density of electronic circuits require innovative packaging solutions to enhance device integration, functionality, and reduce size, while existing technologies face challenges in efficiently stacking devices with different functionalities and technologies.
Innovation Solution
The proposed solution involves a substrate with a cavity for one semiconductor die and another die stacked above it, with mechanical and electrical bonding using coupling mechanisms like solder balls or micro bumps, allowing for flexible integration of various types and sizes of dies, including FPGA circuitry, to form a stacked configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If devices are arranged in a three-dimensional stacked configuration, then circuit density and device integration are increased, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the electronic system into multiple separate semiconductor dies that are stacked vertically. Each die can be independently fabricated, tested, and packaged, then bonded together to form a three-dimensional assembly. This segmentation allows complex functionality to be distributed across multiple simpler components, increasing overall circuit density while managing device complexity through modular architecture.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar arrangement of electronic components to a three-dimensional stacked configuration. By adding the vertical dimension, the system achieves higher circuit density without increasing the footprint area. Multiple dies are bonded face-to-face in the vertical direction, creating a stacked architecture that充分利用s three-dimensional space for enhanced integration.
2Speed
If devices are stacked in a three-dimensional configuration, then interconnect lengths are decreased and signal propagation is faster, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates test structures and test circuitry on each semiconductor die before the stacking process. These preliminary tests allow for verification of die functionality and identification of defects before bonding. Test structures include pad openings, test pads, and test circuitry that enable electrical testing of interconnects and circuit functionality at intermediate stages, ensuring quality control in the multi-die assembly process.
Solution Approach 2:
The patent uses substrate or carrier structures as intermediaries during the die stacking process. These substrates provide mechanical support, alignment features, and bonding surfaces that facilitate precise positioning and bonding of multiple dies. The substrate acts as a temporary carrier that holds dies in the correct spatial relationship during assembly, then can be removed after bonding is complete, enabling manufacturing precision in the stacked configuration.
3Adaptability or versatility
If different types of devices are mixed and matched in a stack, then functionality and adaptability are enhanced, but ease of manufacture decreases
Solution Approach 1:
The patent employs universal bonding interfaces and standardized test structures that can accommodate different types of semiconductor dies with various functionalities. The bonding pads, interconnect structures, and test circuitry are designed with universal characteristics that allow different die types (e.g., logic, memory, analog) to be stacked together using the same assembly process, enhancing adaptability while maintaining ease of manufacture through standardization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased circuit density, reduced interconnect lengths, faster signal propagation, lower power dissipation, and the ability to mix different functionalities, resulting in more compact, efficient, and flexible electronic systems.
Implementation Method 1
The other die is disposed above the first die and is electrically coupled to the first die
Data Source
AI summary
An apparatus includes a substrate and a pair of die that include electronic circuitry. The substrate includes a cavity. One of the die is disposed in the cavity formed in the substrate. The other die is disposed above the first die and is electrically coupled to the first die.