Stacked-Die Clock Load Model Analysis
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Solution Overview
Problem
Conventional clock tree synthesis tools are inadequate for generating and balancing clock distribution networks in advanced integrated circuit designs, such as system on a chip and stacked-die ICs, which require analysis across multiple chips while meeting clocking performance requirements.
Innovation Solution
A method that determines clock load information for a primary die and incorporates it into a clock load model, allowing for the creation of an enhanced clock load model that analyzes the stacked-die IC as a single-die IC, enabling effective analysis and balancing of clock distribution networks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional single-die clock tree synthesis tools are used for stacked-die IC analysis, then the analysis process becomes infeasible for multi-die systems, but attempting to use them would result in inadequate clock distribution analysis capability
Solution Approach 1:
The patent segments the stacked-die IC into individual die components, each represented by an equivalent clock load model. This allows the complex multi-die system to be broken down into manageable units that can be analyzed separately and then combined, making the system compatible with conventional single-die analysis tools while maintaining analysis accuracy.
Solution Approach 2:
The patent creates equivalent clock load models that replicate the electrical characteristics of actual die components. These models serve as simplified copies that behave identically to the real components in terms of clock load, enabling accurate analysis using conventional tools without requiring complex multi-die simulation capabilities.
2Measurement precision
If clock load models for multiple dies are combined into a single enhanced model, then accurate clock distribution analysis is achieved, but the complexity of model creation and integration increases
Solution Approach 1:
The patent merges individual die clock load models into a single enhanced clock load model that represents the entire stacked-die IC. This consolidation allows conventional analysis tools to work with the complete system as if it were a single die, achieving accurate clock skew analysis while simplifying the overall analysis process through unified model representation.
Solution Approach 2:
The patent introduces an intermediary process that automatically integrates individual die models into the enhanced clock load model. This intermediary layer handles the complexity of model combination, parameter matching, and electrical characteristic preservation, shielding the user from the intricacies while ensuring measurement precision.
3Manufacturing precision
If buffers are added to balance clock tree branches, then clock skew is reduced, but the number of components and circuit complexity increases
Solution Approach 1:
The patent performs preliminary analysis using the enhanced clock load model to identify branches requiring buffer insertion before final clock tree synthesis. This preliminary action allows for optimized buffer placement that minimizes the number of components needed while achieving the required clock skew balance, reducing overall circuit complexity.
Solution Approach 2:
The patent uses parameter-based optimization to determine the minimum number and optimal placement of buffers required for clock tree balancing. By analyzing clock load parameters and distribution characteristics, the system identifies the precise buffer configuration needed, avoiding unnecessary components and reducing circuit complexity while maintaining synchronization accuracy.
Data Source
AI summary
Systems and methods for distribution analysis of a stacked-die integrated circuit (IC) are described. The stacked-die integrated circuit includes a primary die, and clock load information for the primary die of the IC is determined. Additionally, a clock load model may be created using the clock load information for the primary die. Clock load information for a second die that is coupled to the primary die may also be determined. The clock load information for the second die may be incorporated into the clock load model to create an enhanced clock load model of the stacked-die IC, which may then be analyzed as if a single-die IC.