Stacked Die Dual-Path Interconnect for Flexible Die Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of designing stacked integrated circuit devices with multiple die is the complexity arising from requiring different connection sets for each die, which increases design complexity and latency.
Innovation Solution
A stacked integrated circuit device with each die having two input and two output paths, allowing either die to function as top or bottom without altering the connection design, using identical layouts for input and output paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different connection sets are designed for top and bottom die, then communication between stacked die is achieved, but design complexity increases
Solution Approach 1:
Each die is designed with identical dual input and dual output paths that can function in either top or bottom position in the stack. The connection architecture is universal across all die, allowing the same die design to be used repeatedly without modification. This eliminates the need for different connection sets for top and bottom die, reducing design complexity while maintaining reliable communication.
Solution Approach 2:
The connection paths are segmented into distinct first and second input paths, and first and second output paths for each die. This segmentation allows independent configuration of connection directions, where each path can be selectively connected or disconnected based on the die's position in the stack, simplifying the overall design.
2Reliability
If different connection sets are designed for top and bottom die, then communication between stacked die is achieved, but latency increases
Solution Approach 1:
The universal dual-path connection architecture enables optimal signal routing regardless of die position. Both top and bottom die have identical connection capabilities, allowing simultaneous bidirectional communication without sequential handshaking delays. This reduces latency compared to asymmetric designs where communication must follow fixed directional protocols.
3Ease of manufacture
If identical connection layouts are used for all die, then design process is simplified, but flexible die positioning is required
Solution Approach 1:
The identical connection layouts on all die provide universality that inherently enables flexible positioning. Each die can be placed in any position within the stack (top, bottom, or intermediate) without requiring design modifications. The dual input and dual output paths automatically adapt to the die's position, providing both manufacturing simplicity and positioning flexibility simultaneously.
Solution Approach 2:
The connection paths are designed to be dynamically adaptable to the die's position in the stack. The first and second input/output paths can be selectively activated or deactivated based on whether the die is positioned at the top, bottom, or intermediate locations, allowing the same static layout to serve multiple dynamic configurations.
Data Source
AI summary
In a stacked integrated circuit device, there are two components, one in a first of the die and another in a second of the die. Each of the components is provided with two output connections, one leading above and one leading below the die, and two input connections, one leading above and one leading below the die, either of the two die. As a result of the redundancy, both die may be used in either position in the stacked structure. If either of the die is used as the top die, it sends data on its second output path and receives data on its second input path. On the other hand, when one of the die is used as the bottom die, it sends data on its first output path and receives data on its first input path. In this way, the same design may be used for the connections between each of the die.