Stacked Die Interconnect Fault Detection With Robust Signal Return
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Solution Overview
Problem
The challenge in stacked semiconductor apparatuses is the occurrence of faults such as unintended short circuits and open circuits in signal transmission members, which hinders the integration and yield of compact, high-density semiconductor packages.
Innovation Solution
A stacked semiconductor apparatus is designed with a first die and a second die, incorporating test modules and multiplexers to generate and receive test patterns, and robust and bypass transmission members to detect and reroute signals, allowing for fault detection and repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If signal transmission members are used to transmit data between stacked dies, then integration density and compactness are improved, but faults such as short circuits and open circuits may occur in the signal transmission members
Solution Approach 1:
The patent implements preliminary fault detection by incorporating test modules that perform detection operations before the stacked semiconductor apparatus is shipped. Test patterns are generated and transmitted through signal transmission members to detect faults in advance, allowing defective products to be identified and excluded before reaching customers, thus preventing field failures while maintaining high integration density
Solution Approach 2:
The patent establishes a feedback mechanism where test modules transmit test patterns through signal transmission members and receive reflected or returned signals to determine whether faults exist. This closed-loop feedback system enables automatic detection and identification of defective signal transmission members, allowing for selective bypass or repair operations that maintain overall system reliability
2Productivity
If multiple signal transmission members are used for high integration, then manufacturing complexity increases, but fault detection and repair capability must also be maintained
Solution Approach 1:
The patent divides the signal transmission system into independently testable segments by assigning specific test patterns to specific signal transmission members. Each signal transmission member can be individually detected, isolated, and repaired without affecting others, allowing complex multi-member systems to be managed through modular segmentation that maintains high manufacturing yield
Solution Approach 2:
The patent introduces test modules as intermediary components that facilitate fault detection between stacked dies. These test modules act as mediators by generating test patterns, transmitting them through signal transmission members, and analyzing returned signals to identify faults. This intermediary layer simplifies the complexity of direct fault detection in dense signal transmission networks while maintaining high productivity
Data Source
AI summary
A stacked semiconductor apparatus, which is formed by stacking a first die and a second die, includes the first die including a first test module configured to generate a test pattern and a plurality of transmission multiplexers, each of which one input receives the test pattern, the second die including a plurality of reception multiplexers and a second test module configured to control the plurality of reception multiplexers, and a connection part including a plurality of signal transmission members electrically connected to outputs of the plurality of transmission multiplexers and each connected to one input of the reception multiplexers, and a robust transmission member configured to transmit a signal between the first test module and the second test module, wherein the second test module transmits a signal, which is received by the reception multiplexer through the signal transmission member, to the first test module through the robust transmission member, and the first test module detects a fault of the signal transmission member by comparing the test pattern with the signal transmitted by the second test module through the robust transmission member.