Stacked-Die Package Grounding via Conductive Adhesive
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor integrated circuit packages with insulative substrates like SOI, achieving electrical grounding of the base layer is challenging due to the insulating layer, which prevents direct electrical connection from the top layer circuitry to the lower substrate, making it difficult to ground the integrated circuit device effectively.
Innovation Solution
The use of electrically conductive adhesives and wire bonding techniques to connect the insulated base of the SOI device to a ground plane, or a metal inter-plate feature to establish electrical communication with the ground, allowing grounding regardless of die size or stacking configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to ground the base layer in SOI devices, then electrical grounding is achieved, but the process becomes more complex and costly
Solution Approach 1:
The patent introduces an intermediary conductive adhesive layer between the SOI base layer and the die-attach paddle to establish electrical grounding. This mediator transfers the grounding function from complex wire bonding to a simpler adhesive-based solution, resolving the contradiction between achieving reliable grounding and reducing process complexity
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a chemical adhesive bonding system. The conductive adhesive chemically bonds the base layer to the grounded paddle, substituting the mechanical wire attachment process and thereby reducing overall device complexity while maintaining grounding effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective electrical grounding of all layers of the integrated circuit device, even when not in direct contact with the die-attach paddle, simplifying the grounding process and reducing costs by allowing grounding of SOI devices in stacked packages.
Implementation Method 1
The electrically conductive adhesive layer electrically couples the insulated base portion of the SOI device to a ground pad on the first semiconductor device
Data Source
AI summary
Method and apparatus are provided for semiconductor device packages. In an example, an apparatus can include a first semiconductor device, a ground pad situated on an uppermost portion of the first semiconductor device and configured to electrically couple portions of the first semiconductor device to aground potential, and a second semiconductor device having at least a portion in electrical communication with an uppermost face of the first semiconductor device through a first electrically-conductive adhesive. In an example, the first electrically-conductive adhesive can be electrically coupled to the ground bond pad on the first semiconductor device.