3D Stacked Semiconductor Die Layout for Heat Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing SoCs face issues with heat trapping and insufficient heat dissipation due to stacking semiconductor dies with the same configuration, leading to increased heat density and longer design times and higher costs when manufacturing dies with different layouts.
Innovation Solution
A semiconductor die design with specific bonding pad arrangements allows for efficient heat dissipation by shifting the positions of bonding pads between stacked semiconductor dies, using inter-die interface circuits to connect pads in a manner that redistributes heat sources, facilitating better thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor dies with the same configuration are stacked in three-dimensional stacking, then manufacturing cost and design time are reduced, but heat dissipation becomes insufficient due to increased heat density
Solution Approach 1:
The patent applies asymmetry by intentionally designing different arrangements of functional circuits and bonding pads on the top and bottom surfaces of the semiconductor die. Specifically, the first inter-die interface circuit has a first arrangement of functional circuits and first bonding pads, while the second inter-die interface circuit has a second arrangement that is deliberately different from the first. This asymmetric design causes heat sources to be distributed at different locations in stacked dies, preventing heat concentration and improving heat dissipation while maintaining manufacturing efficiency.
Solution Approach 2:
The patent implements local quality by creating different circuit arrangements in different regions of the die. The top surface contains a first inter-die interface circuit with specific functional circuit arrangements, while the bottom surface contains a second inter-die interface circuit with different functional circuit arrangements. This allows different parts of the die to have optimized characteristics for their specific functions, and when stacked, creates a three-dimensional distribution of heat sources that improves overall heat dissipation.
2Temperature
If semiconductor dies with different layouts are manufactured to shift heat generation locations, then heat dissipation is improved, but design time and manufacturing cost increase
Solution Approach 1:
The patent applies universality by designing a single semiconductor die structure that serves multiple functions. The die includes both a first inter-die interface circuit on the top surface and a second inter-die interface circuit on the bottom surface, allowing the same die design to be used in both upward and downward stacking directions. This multi-functional design eliminates the need to create separate mirror-image layouts, reducing design time and complexity while still achieving heat distribution benefits.
Solution Approach 2:
The patent employs inversion by creating the second inter-die interface circuit with a different arrangement from the first, rather than using identical or mirror-image configurations. The second arrangement of functional circuits and bonding pads is deliberately designed to be different from the first arrangement, which inverts the conventional approach of using symmetric designs. This inversion strategy achieves heat distribution while maintaining design efficiency.
3Temperature
If multiple inter-die interface circuits with different arrangements are included in the semiconductor die, then heat sources are distributed effectively, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the semiconductor die into distinct functional regions: a first inter-die interface circuit on the top surface and a second inter-die interface circuit on the bottom surface. Each interface circuit is further segmented into functional circuits and bonding pads with specific arrangements. This segmentation allows each region to be optimized independently for its specific function while contributing to overall heat distribution when the die is stacked.
Data Source
AI summary
A semiconductor die includes: a main body including a top surface and a bottom surface; a plurality of first bonding pads disposed on the top surface; and a plurality of second bonding pads disposed on the bottom surface. When viewed in a direction perpendicular to the top surface or the bottom surface, the plurality of first bonding pads are disposed at positions that match positions to which the plurality of second bonding pads are shifted in a plane of the bottom surface while maintaining a positional relationship between the plurality of second bonding pads. The main body includes a first inter-die interface circuit and a second inter-die interface circuit. The plurality of first bonding pads are connected to the first inter-die interface circuit, and the plurality of second bonding pads are connected to the second inter-die interface circuit.