Stacked Die Structure With Extended Heat Dissipation Panels
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Solution Overview
Problem
As the number of stacked dies in high bandwidth memory (HBM) increases, heat accumulation leads to performance issues due to reduced heat dissipation space, affecting both mechanical and electrical performance.
Innovation Solution
A semiconductor structure is designed with a stack structure that includes heat dissipation panels extending beyond the die modules, allowing for efficient heat dissipation through a larger surface area, utilizing materials with high thermal conductivity and microchannel heat dissipation, and strategically arranging die modules with heat dissipation panels to enhance heat transfer and prevent heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked dies is increased to improve memory capacity and bandwidth, then the density and capacity of the memory are greatly improved, but heat accumulation occurs which causes mechanical cracks and degrades electrical performance
Solution Approach 1:
The patent introduces heat dissipation panels that extend in the lateral dimension beyond the die modules, creating a three-dimensional heat dissipation structure. This allows heat to be dissipated not only vertically through the die stack but also laterally through the extended panels, effectively adding another dimension for heat management in high-density stacked die configurations
Solution Approach 2:
The heat dissipation panels serve as intermediary structures between the heat-generating die modules and the external environment. These panels act as thermal mediators that intercept and conduct heat away from the die stack before it can accumulate and cause mechanical or electrical degradation
2Loss of energy
If heat dissipation panels are added to improve heat dissipation, then heat transfer efficiency is enhanced, but the device structure becomes more complex
Solution Approach 1:
The heat dissipation panels are merged with the carrier structure and die modules to form an integrated stack structure. This combination allows the heat dissipation function to be incorporated into the existing memory architecture without requiring completely separate heat management components, thereby enhancing heat dissipation while limiting the increase in overall structural complexity
Solution Approach 2:
The heat dissipation panels serve multiple functions: they act as thermal conduction paths, provide structural support for the stacked dies, and extend the mechanical interface for mounting. This multi-functionality allows effective heat dissipation to be achieved without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively accelerates heat dissipation, preventing performance degradation and mechanical stress, while maintaining a compact semiconductor structure by ensuring efficient heat transfer and distribution.
Implementation Method 1
utilizing materials with high thermal conductivity and microchannel heat dissipation
Data Source
AI summary
A semiconductor structure includes a carrier structure, and a stack structure located on the carrier structure. The stack structure includes at least one heat dissipation panel and at least one die module stacked onto one another, and the at least one die module includes at least one die. An area of an orthographic projection of the at least one heat dissipation panel on the carrier structure is greater than an area of an orthographic projection of the at least one die module on the carrier structure.